Patents by Inventor Anne Leahy

Anne Leahy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10066213
    Abstract: The invention relates to a process for increasing the observed titer of a virus stock for the purpose of increasing the calculated log reduction (LRV) in virus clearance studies. A tissue culture or assay plate is seeded with an indicator cell line and titrated with a virus stock followed, by a centrifugation step for about 5 minutes to about 24 hours at a g-force ranging from about 50×g to about 2400×g, and at a temperature from about 4° C. to about 39° C. The resulting calculated virus titer after undergoing the centrifugation step is 10-fold higher than the virus titer would be if determined in the absence of the centrifuging step.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: September 4, 2018
    Assignee: EMD Millipore Corporation
    Inventors: Damon Asher, Anne Leahy
  • Publication number: 20150166965
    Abstract: The invention relates to a process for increasing the observed titer of a virus stock for the purpose of increasing the calculated log reduction (LRV) in virus clearance studies. A tissue culture or assay plate is seeded with an indicator cell line and titrated with a virus stock followed, by a centrifugation step for about 5 minutes to about 24 hours at a g-force ranging from about 50×g to about 2400×g, and at a temperature from about 4° C. to about 39° C. The resulting calculated virus titer after undergoing the centrifugation step is 10-fold higher than the virus titer would be if determined in the absence of the centrifuging step.
    Type: Application
    Filed: March 13, 2013
    Publication date: June 18, 2015
    Inventors: Damon Asher, Anne Leahy
  • Patent number: 6703697
    Abstract: An electronic package with improved power delivery performance, lowering the impedance associated with the power delivery. The electronic package includes an integrated circuit die mounted on the substrate of the electronic package and decoupling capacitors placed underneath the substrate. The package further includes stand-offs placed underneath the substrate, sized for maintaining a distance between the capacitors and another substrate.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: March 9, 2004
    Assignee: Intel Corporation
    Inventors: Anne Leahy, Ajit Sathe
  • Publication number: 20030110452
    Abstract: An electronic package with improved power delivery performance, lowering the impedance associated with the power delivery. The electronic package includes an integrated circuit die mounted on the substrate of the electronic package and decoupling capacitors placed underneath the substrate. The package further includes stand-offs placed underneath the substrate, sized for maintaining a distance between the capacitors and another substrate.
    Type: Application
    Filed: December 7, 2001
    Publication date: June 12, 2003
    Inventors: Anne Leahy, Ajit Sathe