Abstract: The invention relates to a polymer composite, particularly an optical film, comprising a water insoluble polymer having dispersed therein inorganic nanoparticles modified on their surface with a monolayer of a silane of Formula 1. X—SiR1R2Y??(I) wherein X is Cl or an alkoxy group; R1 and R2 are independently Cl, an alkoxy group, or 13 CnH2n+1; and Y is an organic functional group.

Abstract: This invention relates to an optical film comprising a first component having a birefringence dispersion of D1>1 and a second component having a birefringence dispersion of D2<1, wherein the birefringence ratio of the first and second component is delta n1/delta n2>0, wherein the optical film has a reverse birefringence dispersion of D<1.

Abstract: A method for reducing the dissolution of aluminum gate electrodes in a high pH clean chemistry comprises modifying the high pH clean chemistry to include a silanol-based chemical. The silanol-based chemical causes a protective layer to form on a top surface of the aluminum gate electrode. The protective layer substantially reduces or prevents corrosion that occurs due to the high pH level of the clean chemistry. The protective layer is formed by the silanol-based chemical bonding to the aluminum gate electrode through a hydrolysis reaction, thereby forming a silanol-based protective layer.

Abstract: Described herein are embodiments of a slurry used for the chemical mechanical polishing a substrate that includes aluminum or an aluminum alloy features having a width of less than 1 um. The slurry includes a precipitated silica abrasive having a diameter of less than or equal to 100 nm and a chelating buffer system comprising citric acid and oxalic acid to provide a pH of the slurry in the approximate range of 1.5 and 4.0.

Abstract: A package comprising a bag having lines of weakness and a pull-tab opener secured to the bag proximate to the lines of weakness, the pull-tab opener having a pull-tab opening integral therewith, wherein the pull-tab opening is designed to be hooked with hooking means. In one embodiment, a sealed container is provided comprising a flexible bag having lines of weakness with at least one product disposed within the bag. In a preferred embodiment, the pull-tab opener is a reusable pull-tab opener.

Abstract: A slurry for use in a chemical mechanical polishing process for planarizing copper-based metal structures on a substrate comprises an oxidizer, an organic complexing agent, surfactants, and a plurality of copper-based metal abrasive particles, wherein the copper in the copper-based metal is capable of dissolving into the slurry and forming copper ion complexes. During the chemical mechanical polishing process, the copper removal rate may be selectively increased by increasing the concentration of copper metal abrasive particles in the slurry, and the copper removal rate may be selectively decreased by decreasing the concentration of copper metal abrasive particles in the slurry.

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include providing a substrate comprising at least one opening, and then applying a nanotube slurry comprising at least one nanotube to the substrate, wherein the at least one nanotube is substantially placed within the at least one opening.

Abstract: Relatively large oxide particles formed during the CMP process can scratch a conductive material being polished. An interference agent is added the polishing slurry, which results in significant reduction in scratching of the conductive material by interfering with the formation of the large oxide particles. The interference agent may comprise materials such as anionic surfactants or reactive silanol agents.

Abstract: Replacement metal gates may be formed by removing a polysilicon layer from a gate structure. The gate structure may be formed by patterning the polysilicon layer and depositing a spacer layer over the gate structure such that the spacer layer has a first polish rate. The spacer layer is then etched to form a sidewall spacer. An interlayer dielectric is applied over the gate structure with the sidewall spacer. The interlayer dielectric has a second polish rate higher than the first polish rate. In one embodiment, the interlayer dielectric has a lower polish rate than that of oxide.

Abstract: A method for making a semiconductor device is described. That method comprises forming a dielectric layer on a substrate, forming a trench within the dielectric layer, and forming a high-k gate dielectric layer within the trench. After forming a first metal layer on the high-k gate dielectric layer, a second metal layer is formed on the first metal layer. At least part of the second metal layer is removed from above the dielectric layer using a polishing step, and additional material is removed from above the dielectric layer using an etch step.

Abstract: A method of forming a microelectronic structure and its associated structures is described. In one embodiment, a substrate is provided with a sacrificial layer disposed on a hard mask layer, and a metal layer disposed in a trench of the substrate and on the sacrificial layer. The metal layer is then removed at a first removal rate wherein a dishing is induced on a top surface of the metal layer until the sacrificial layer is exposed, and simultaneously removing the metal layer and the sacrificial layer at a second removal rate without substantially removing the hard mask.

Abstract: A method of forming a microelectronic structure and its associated structures is described. That method comprises providing a substrate comprising a sacrificial layer disposed on a hard mask layer, and a metal layer disposed in a trench of the substrate and on the sacrificial layer, removing the metal layer at a first removal rate wherein a dishing is induced on a top surface of the metal layer until the sacrificial layer is exposed, and simultaneously removing the metal layer and the sacrificial layer at a second removal rate without substantially removing the hard mask.

Abstract: A slurry for copper polishing has a pH between 7.5 and 12. In a particular embodiment of the present invention, a slurry for polishing copper has a pH between 8 and 11.5, and includes a SiO2 abrasive, a (NH4)2S2O8 oxidizer, a benzotriazole corrosion inhibitor, and a K3PO4/K2HPO4 buffer. A copper polish slurry, in accordance with the present invention, operates with a high pH of greater than approximately 7.5. In this range the slurry has a low static etch due to formation of a robust, protective layer. This slurry may additionally have S2O8?2 or Fe(CN)6?3 as an oxidizer and can thus offer a high polish rate on the order of 7,000 to 10,000 angstroms per minute which does not decrease significantly during polishing. Such an inventive slurry offers a wide CMP process window such that the slurry and process parameters can be optimized to yield low recess, erosion, and dishing on patterned wafers.

Abstract: The present application discloses process comprising providing a wafer, the wafer comprising an inter-layer dielectric (ILD) having a feature therein, an under-layer deposited on the ILD, and a barrier layer deposited on the under-layer, and a conductive layer deposited in the feature, placing the wafer in an electrolyte, such that at least the barrier layer is immersed in the electrolyte, and applying an electrical potential between the electrode and the wafer.

Abstract: An automatic blood sampling device is provided with a housing (12, 14, 18, 20), a reciprocable shaft (50) disposed in the housing (12, 14, 18, 20), and a lancet (40) operatively coupled to the shaft (50). The lancet (40) is movable between a retracted position in which the lancet (40) is disposed within the housing (12, 14, 18, 20) and an extended position in which the lancet (40) extends outside of the housing (12, 14, 18, 20).

Abstract: An apparatus for welding a reinforcing member to a bag-like device or contraceptive device is disclosed. The apparatus includes at least one hollow mandrel. The hollow mandrel has an outer surface with an annular groove for holding the reinforcing member. The apparatus has a means for applying a closed end of the bag-like device into the hollow mandrel and an open end of the bag-like device over the hollow mandrel at the outer surface with the annular groove for holding the reinforcing member. The apparatus also includes a welding device for welding the reinforcing member to the bag-like device. A method for welding the reinforcing member to a bag-like device is also disclosed.

Abstract: An apparatus for welding a reinforcing member to a bag-like device or contraceptive device is disclosed. The apparatus includes at least one hollow mandrel. The hollow mandrel has an outer surface with an annular groove for holding the reinforcing member. The apparatus has a means for applying a closed end of the bag-like device into the hollow mandrel and an open end of the bag-like device over the hollow mandrel at the outer surface with the annular groove for welding holding the reinforcing member. The apparatus also includes a welding device for the reinforcing member to the bag-like device. A method for welding the reinforcing member to a bag-like device is also disclosed.

Abstract: An eye protector having a body with an upper edge, a lower edge and an arcuate portion extending between the upper and lower edges. The body is dimensioned to fit over the eye so that, in doing so, the upper edge is positioned closely adjacent and above the eye while the lower edge is positioned closely adjacent and below the eye. The body is constructed so that the weight of the body between a midline extending across the arcuate section and the top edge of the body is greater than the remainder of the body. In addition, a plurality of spaced ridges extend outwardly from the anterior surface of the arcuate section which form cooling fins to cool the body. Ventilation holes are also formed in opposite lateral sides of the protector for cooling of the eyeball.

Abstract: A jigsaw blade (4) having diametrically opposed bayonet lugs (10) is retained within a bayonet fitting (6) provided on the end of a jigsaw drive shaft (3) by a locking device, which can be moved to permit removal of blade without the use of a separate tool. In one embodiment the locking device comprises a locking member (13) which engages the upper end (11) of the blade and is biased towards the blade by a spring (14). A tension member (18) is connected to the locking member (13) and to a manually operable tensioning device, whereby the locking member (13) may be lifted to compress the spring (14) until lugs (17) on the locking member (13) are clear of entry slots (6) of the bayonet fitting. The blade (4) may then be rotated to align the lugs (10) with the entry slots (8), and the blade removed. In an alternative embodiment, the locking member is a screw which engages the upper end (11) of the blade, and is rotatable by a screw rotating member with which it is in permanent sliding engagement.