Patents by Inventor Anneliese Mueller

Anneliese Mueller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods using an RF circuit on isolating material
    Patent number: 10916515
    Abstract: A device is disclosed that includes a wafer/chip, a first layer, a first device, an isolation mold and a second device. The first layer is formed over the chip and has non-isolating characteristics. The first device is formed over the first layer. In one example, it is formed only over the first layer. The isolation mold is formed over the chip. The isolation mold has isolating characteristics. The second device is formed substantially over the isolation mold.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: February 9, 2021
    Assignee: Infineon Technologies AG
    Inventors: Carsten Ahrens, Anton Steltenpohl, Edward Fuergut, Anneliese Mueller
  • SYSTEMS AND METHODS USING AN RF CIRCUIT ON ISOLATING MATERIAL
    Publication number: 20200006262
    Abstract: A device is disclosed that includes a wafer/chip, a first layer, a first device, an isolation mold and a second device. The first layer is formed over the chip and has non-isolating characteristics. The first device is formed over the first layer. In one example, it is formed only over the first layer. The isolation mold is formed over the chip. The isolation mold has isolating characteristics. The second device is formed substantially over the isolation mold.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Inventors: Carsten Ahrens, Anton Steltenpohl, Edward Fuergut, Anneliese Mueller
  • Systems and Methods Using an RF Circuit on Isolating Material
    Publication number: 20160118353
    Abstract: A device is disclosed that includes a wafer/chip, a first layer, a first device, an isolation mold and a second device. The first layer is formed over the chip and has non-isolating characteristics. The first device is formed over the first layer. In one example, it is formed only over the first layer. The isolation mold is formed over the chip. The isolation mold has isolating characteristics. The second device is formed substantially over the isolation mold.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 28, 2016
    Inventors: Carsten Ahrens, Anton Steltenpohl, Edward Fuergut, Anneliese Mueller