Abstract: The present disclosure discloses an ultrasonic transducer and a manufacturing method. The ultrasonic transducer for an ultrasonic fingerprint sensor comprises a piezoelectric layer, receiving electrode lines, emitting electrode lines, a substrate, connecting electrodes and bonding wires. Wherein the piezoelectric layer comprises an array of piezoelectric pillars. The plurality of receiving electrode lines are formed on the piezoelectric layer. The plurality of emitting electrode lines being formed beneath the piezoelectric layer. The substrate is formed under the emitting electrode lines. The connecting electrodes are formed under the substrate. The bonding wires are configured to connect the receiving electrode lines with the connecting electrodes and to connect the emitting electrode lines with the connecting electrodes.

Abstract: The present disclosure discloses a fingerprint sensor and a fingerprint identification module. The fingerprint sensor comprises a substrate and an ultrasonic transducer. The upper surface of the substrate is provided with a plurality of first connecting electrodes, wherein the lower surface of the substrate is provided with a plurality of second connecting electrodes, and wherein the first connecting electrodes are configured to electrically connect with the second electrodes. The ultrasonic transducer is provided on the upper surface, wherein the ultrasonic transducer comprises a plurality of third connecting electrodes, and wherein the third connecting electrodes are configured to electrically connect with the first connecting electrodes.

Abstract: The present disclosure relates to the field of biological recognition and provides a face recognition method and device and apparatus. The face recognition method includes: recording a face video image and dynamically tracking an eye in the face video image; detecting a blink frequency of the eye during dynamic tracking of the eye; judging whether the blinking frequency is within a preset frequency range; if the blink frequency is within the preset frequency range, determining that the face is a living face; if the blink frequency is not within the preset frequency range, determining that the face is a fake face. In the embodiment of the present disclosure, the real face and the fake face can be accurately distinguished by the blink frequency of the eye. Therefore, the safety of face recognition is improved.

Abstract: The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes an active layer. The active layer includes an array of piezoelectric pillars configured for emitting and receiving ultrasound and an attenuation portion surrounding sidewalls of the piezoelectric pillars and configured for attenuating a part of the ultrasound emitted from the sidewalls of the piezoelectric pillars. The present disclosure also relates to an ultrasonic fingerprint recognition sensor and an electronic device having the ultrasonic transducer.

Abstract: The present disclosure provides a manufacturing method of an ultrasonic fingerprint sensor. The method includes steps of: etching a plurality of through holes arranged in an array on an insulating substrate to form a frame; filling piezoelectric material into the through holes to form a plurality of piezoelectric posts corresponding to the plurality of through holes. The present disclosure also provides an ultrasonic fingerprint sensor. In the ultrasonic fingerprint sensor and the manufacturing method of the same according to the embodiment of the present disclosure, the frame is formed on the insulating substrate by etching, and the piezoelectric material is filled in the frame to form the piezoelectric posts to form the ultrasonic fingerprint sensor. The cost of the ultrasonic fingerprint sensor can be reduced because the etching apparatus is low-cost and the process is simple.

Abstract: The present disclosure provides an ultrasonic probe. The ultrasonic probe includes a piezoelectric layer, including a number of piezoelectric posts arranged in a number of rows along a first direction and arranged in a number of columns along a second direction, and an angle between the first direction and the second direction being an acute angle, a distance between the two adjacent piezoelectric posts along the first direction being greater than a distance between the two adjacent rows of the piezoelectric posts. The ultrasonic probe improves the density of the piezoelectric post by misaligning the two adjacent rows of piezoelectric posts and compressing the row spacing, which makes better use of the space between the two adjacent rows of piezoelectric posts. That is, the space utilization of the ultrasonic probe is improved and pixel density is high.

Abstract: The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, an ultrasonic probe, and packaging material. The substrate includes a substrate top surface and a plurality of first connection electrodes formed on the substrate top surface. The control chip includes a chip bottom surface and a plurality of second connection electrodes formed on the chip bottom surface. The control chip is connected to the substrate using a flip chip mounting technology. The second connection electrodes are connected to the first connection electrodes. The ultrasonic probe is arranged on the control chip, and configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate and the control chip, and fixes the ultrasonic probe using a molding technology.

Abstract: The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, bonding wires, an ultrasonic probe, and packaging material. The control chip is arranged on the substrate. The control chip is connected to the substrate by the bonding wires using a wire bonding technology. The ultrasonic probe is arranged on the control chip and is configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate, the control chip, and the bonding wires and fixing the ultrasonic probe using a molding technology.

Abstract: The present disclosure discloses a package for an ultrasonic fingerprint sensor comprising: a substrate comprising a top surface and a plurality of first connecting electrodes formed on the top surface; a control chip arranged on the substrate and comprising a periphery-stepped upper surface facing away from the substrate, the periphery-stepped upper surface comprising a central upper surface and a peripheral lower surface surrounding and being lower than the central upper surface, the control chip comprising a plurality of second connecting electrodes formed on the central upper surface, and a plurality of third connecting electrodes formed on the peripheral lower surface connected to the second connecting electrodes; bonding wires configured to bond the first connecting electrodes to the third connecting electrodes; an ultrasonic transducer arranged on the control chip; and packing material configured to package the substrate, the bonding wires and the ultrasonic transducer as one module.

Abstract: The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes a piezoelectric layer. The piezoelectric layer includes an array of piezoelectric posts, a plurality of emitting electrodes, and a plurality of receiving electrodes. The piezoelectric posts are configured for emitting and receiving ultrasonic wave. The material of each of the piezoelectric posts includes lead zirconate titanate piezoelectric ceramics. The emitting electrodes are formed on a lower surface of the piezoelectric layer by a sputtering process. The receiving electrodes are formed on an upper surface of the piezoelectric layer by the sputtering process. Each of the emitting electrodes and each of the receiving electrodes include lead, zirconium, titanium, and/or alloys thereof.

Abstract: The present disclosure discloses an ultrasonic fingerprint sensor. The ultrasonic fingerprint sensor includes a piezoelectric layer, a number of emitters, and a number of receiving electrode lines. The piezoelectric layer includes an array of piezoelectric posts. The emitters are formed on a lower end of the piezoelectric layer and correspond to the piezoelectric posts. Each of the emitters is connected to a corresponding piezoelectric post. The receiving electrode lines are arranged on an upper end of the piezoelectric layer, and each of the receiving electrode lines corresponds to a row of the piezoelectric posts and connected to the row of the piezoelectric posts. The present disclosure also discloses a fingerprint recognition module.

Abstract: The present disclosure relates to the field of biological recognition and provides a face recognition method and device and apparatus. The face recognition method includes: recording a face video image and dynamically tracking an eye in the face video image; detecting a blink frequency of the eye during dynamic tracking of the eye; judging whether the blinking frequency is within a preset frequency range; if the blink frequency is within the preset frequency range, determining that the face is a living face; if the blink frequency is not within the preset frequency range, determining that the face is a fake face. In the embodiment of the present disclosure, the real face and the fake face can be accurately distinguished by the blink frequency of the eye. Therefore, the safety of face recognition is improved.

Abstract: The present disclosure provides a manufacturing method of an ultrasonic fingerprint sensor. The method includes steps of: etching a plurality of through holes arranged in an array on an insulating substrate to form a frame; filling piezoelectric material into the through holes to form a plurality of piezoelectric posts corresponding to the plurality of through holes. The present disclosure also provides an ultrasonic fingerprint sensor. In the ultrasonic fingerprint sensor and the manufacturing method of the same according to the embodiment of the present disclosure, the frame is formed on the insulating substrate by etching, and the piezoelectric material is filled in the frame to form the piezoelectric posts to form the ultrasonic fingerprint sensor. The cost of the ultrasonic fingerprint sensor can be reduced because the etching apparatus is low-cost and the process is simple.

Abstract: The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, bonding wires, an ultrasonic probe, and packaging material. The control chip is arranged on the substrate. The control chip is connected to the substrate by the bonding wires using a wire bonding technology. The ultrasonic probe is arranged on the control chip and is configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate, the control chip, and the bonding wires and fixing the ultrasonic probe using a molding technology.

Abstract: The present disclosure discloses an ultrasonic transducer and a manufacturing method. The ultrasonic transducer for an ultrasonic fingerprint sensor comprises a piezoelectric layer, receiving electrode lines, emitting electrode lines, a substrate, connecting electrodes and bonding wires. Wherein the piezoelectric layer comprises an array of piezoelectric pillars. The plurality of receiving electrode lines are formed on the piezoelectric layer. The plurality of emitting electrode lines being formed beneath the piezoelectric layer. The substrate is formed under the emitting electrode lines. The connecting electrodes are formed under the substrate. The bonding wires are configured to connect the receiving electrode lines with the connecting electrodes and to connect the emitting electrode lines with the connecting electrodes.

Abstract: The present disclosure discloses a package for an ultrasonic fingerprint sensor comprising: a substrate comprising a top surface and a plurality of first connecting electrodes formed on the top surface; a control chip arranged on the substrate and comprising a periphery-stepped upper surface facing away from the substrate, the periphery-stepped upper surface comprising a central upper surface and a peripheral lower surface surrounding and being lower than the central upper surface, the control chip comprising a plurality of second connecting electrodes formed on the central upper surface, and a plurality of third connecting electrodes formed on the peripheral lower surface connected to the second connecting electrodes; bonding wires configured to bond the first connecting electrodes to the third connecting electrodes; an ultrasonic transducer arranged on the control chip; and packing material configured to package the substrate, the bonding wires and the ultrasonic transducer as one module.

Abstract: The present disclosure provides an ultrasonic probe. The ultrasonic probe includes a piezoelectric layer, including a number of piezoelectric posts arranged in a number of rows along a first direction and arranged in a number of columns along a second direction, and an angle between the first direction and the second direction being an acute angle, a distance between the two adjacent piezoelectric posts along the first direction being greater than a distance between the two adjacent rows of the piezoelectric posts. The ultrasonic probe improves the density of the piezoelectric post by misaligning the two adjacent rows of piezoelectric posts and compressing the row spacing, which makes better use of the space between the two adjacent rows of piezoelectric posts. That is, the space utilization of the ultrasonic probe is improved and pixel density is high.

Abstract: The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, an ultrasonic probe, and packaging material. The substrate includes a substrate top surface and a plurality of first connection electrodes formed on the substrate top surface. The control chip includes a chip bottom surface and a plurality of second connection electrodes formed on the chip bottom surface. The control chip is connected to the substrate using a flip chip mounting technology. The second connection electrodes are connected to the first connection electrodes. The ultrasonic probe is arranged on the control chip, and configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate and the control chip, and fixes the ultrasonic probe using a molding technology.

Abstract: The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes a piezoelectric layer. The piezoelectric layer includes an array of piezoelectric posts, a plurality of emitting electrodes, and a plurality of receiving electrodes. The piezoelectric posts are configured for emitting and receiving ultrasonic wave. The material of each of the piezoelectric posts includes lead zirconate titanate piezoelectric ceramics. The emitting electrodes are formed on a lower surface of the piezoelectric layer by a sputtering process. The receiving electrodes are formed on an upper surface of the piezoelectric layer by the sputtering process. Each of the emitting electrodes and each of the receiving electrodes include lead, zirconium, titanium, and/or alloys thereof.

Abstract: The present disclosure discloses a fingerprint sensor and a fingerprint identification module. The fingerprint sensor comprises a substrate and an ultrasonic transducer. The upper surface of the substrate is provided with a plurality of first connecting electrodes, wherein the lower surface of the substrate is provided with a plurality of second connecting electrodes, and wherein the first connecting electrodes are configured to electrically connect with the second electrodes. The ultrasonic transducer is provided on the upper surface, wherein the ultrasonic transducer comprises a plurality of third connecting electrodes, and wherein the third connecting electrodes are configured to electrically connect with the first connecting electrodes.