Abstract: A method of repairing a light emitting device assembly includes providing a repair source substrate with an array of first light emitting diodes, providing a first carrier substrate with a temporary adhesive layer thereupon, forming a first assembly including the first carrier substrate and at least one first light emitting diode that is a subset of the array of first light emitting diodes, where the at least one first light emitting diode is attached to the first carrier substrate through a respective portion of the temporary adhesive layer and detached from the repair source substrate, providing a second carrier substrate with a temporary bonding layer thereupon, attaching the at least one first light emitting diode to the temporary bonding layer, detaching the first carrier substrate from each portion of the temporary adhesive layer, removing each portion of the temporary adhesive layer from the at least one first light emitting diode, providing a light emitting device including at least one vacancy locati

Abstract: A method of repairing a light emitting device assembly includes providing a repair source substrate with an array of first light emitting diodes, providing a first carrier substrate with a temporary adhesive layer thereupon, forming a first assembly including the first carrier substrate and at least one first light emitting diode that is a subset of the array of first light emitting diodes, where the at least one first light emitting diode is attached to the first carrier substrate through a respective portion of the temporary adhesive layer and detached from the repair source substrate, providing a second carrier substrate with a temporary bonding layer thereupon, attaching the at least one first light emitting diode to the temporary bonding layer, detaching the first carrier substrate from each portion of the temporary adhesive layer, removing each portion of the temporary adhesive layer from the at least one first light emitting diode, providing a light emitting device including at least one vacancy locati

Abstract: The present invention relates generally to measuring devices, namely calipers. The invention is a measuring device for measuring the height or depth of a conductive element comprising a stabilizing body comprising a beam; at least one leg extending from said beam; a contact affixed to at least one leg, an electrical energy source connected in series with said contact; an indicator connected in series with said electrical energy source and said contact; a caliper comprising a measuring scale; a probe, said probe connected in series with said contact, said electrical energy source, said indicator; and means for affixing the caliper to the beam.