Abstract: The invention relates to a method for disinfecting surfaces comprising providing an active solution comprising the reactants H2O2 and NO2-, wherein the active solution comprises at least one stopping agent, wherein the stopping agent is a solvent having a boiling temperature below 100° C. Furthermore, the invention relates to a device for the application of this process.

Abstract: The invention relates to a disinfection process comprising the feed materials H2O2 and NO2? and a mixing step and a distribution step, wherein the mixing step and the distribution step (during which each point on the surface being disinfected is wetted with a solution of active substance) are implemented during a processing period ZA. An exposure step follows, in which the distributed solution of active substance acts upon the surface in contact with the solution of active substance during an exposure period ZE. In this process, the maximum NO2? concentration during the mixing step is of 300 mM, and the time-integrated reaction rate W is represented during the exposure period ZE by the integral formula (I), where k1 denotes the pH-value-dependent speed constant of the reaction between H2O2 and NO2? and the pH value of the solution of active substance before it contacts the surface being disinfected lies in the range of 2.1?pH?6.8.

Abstract: A modular plasma jet treatment system comprising a plasma source with a high-voltage module comprising a high-voltage electrode and first connection means, as well as a plasma jet applicator wherein the plasma jet applicator comprises a cavity for a process gas, wherein a ceiling portion of the cavity is either arranged on the plasma jet applicator and/or on the high-voltage module, the cavity comprising a process gas inlet and at least one plasma jet outlet, wherein the plasma jet applicator comprises a second connection means, such that the plasma jet applicator and the high-voltage module are repeatedly connectable and releasable, wherein, when the plasma jet applicator is connected to the high-voltage module, the cavity is adjacently arranged with the ceiling portion at the high-voltage module, and wherein the cavity is separated by a dielectric from the high-voltage electrode of the high-voltage module.

Abstract: The invention relates to a disinfection process comprising the feed materials H2O2 and NO2? and a mixing step and a distribution step, wherein the mixing step and the distribution step (during which each point on the surface being disinfected is wetted with a solution of active substance) are implemented during a processing period ZA. An exposure step follows, in which the distributed solution of active substance acts upon the surface in contact with the solution of active substance during an exposure period ZE. In this process, the maximum NO2? concentration during the mixing step is of 300 mM, and the time-integrated reaction rate W is represented during the exposure period ZE by the integral formula (I), where k1 denotes the pH-value-dependent speed constant of the reaction between H2O2 and NO2? and the pH value of the solution of active substance before it contacts the surface being disinfected lies in the range of 2.1?pH?6.8.

Abstract: The invention relates to a method for generating a product gas stream (G), comprising the steps: provision of a process gas stream (P), generation of a reactive gas stream (R) from the process gas stream (P) at reduced pressure, provision of a compressed gas stream (D) and mixing the reactive gas stream (R) with the compressed gas stream (D) with formation of a product gas stream (G).

Abstract: The invention relates to a modular plasma jet treatment system (1), particularly for therapeutic or oral applications, comprising a plasma source (2) with least the following components; a high-voltage module (20) comprising a high-voltage electrode (21) and first connection means, a plasma jet applicator (30) configured to generate at least one plasma jet (35), wherein the plasma jet applicator (30) comprises a cavity (31) for a process gas (100), wherein a ceiling portion (32) of the cavity (31) is either arranged on the plasma jet applicator (30) and/or on the high-voltage module (20), the cavity (31) comprising a process gas inlet (33) and at least one plasma jet outlet (34), wherein the plasma jet applicator (30) comprises a second connection means, wherein the first and second connection means are configured such that the plasma jet applicator (30) and the high-voltage module (20) are repeatedly connectable and releasable, wherein, when the plasma jet applicator (30) is connected to the high-voltage mod