Abstract: The present invention relates to a method for manufacturing an electrical feedthrough assembly of an electric device, the method comprising the step of: providing an electrical feedthrough assembly comprising an insulating body and at least one electrically connecting element extending through said insulating body, and joining said at least one electrically connecting element with a solderable element, wherein joining is performed by an arc welding process. The invention further relates to a respective feedthrough assembly and an electric device comprising such feedthrough assembly.

Abstract: A system and method for marking components of an assembly and/or portions of an assembly including at least one of the components with a plurality of markers, each component and/or portion including its own marker or markers, to be read in an operational sequence so as to generate at least one identifier representative of a characteristic and/or feature of the assembly. Any marker can be a certain type of marker, the combination of which can be used to generate an identifier. A certain type of marker 1 need not be dedicated to a certain component. Each marker can be associated with a proxy value, which can be obtained by reading the marker with a reader. An identifier of the assembly can then be generated by employing a predetermined sequence of reading the markers.

Abstract: A system and method for marking components of an assembly and/or portions of an assembly including at least one of the components with a plurality of markers, each component and/or portion including its own marker or markers, to be read in an operational sequence so as to generate at least one identifier representative of a characteristic and/or feature of the assembly. Any marker can be a certain type of marker, the combination of which can be used to generate an identifier. A certain type of marker 1 need not be dedicated to a certain component. Each marker can be associated with a proxy value, which can be obtained by reading the marker with a reader. An identifier of the assembly can then be generated by employing a predetermined sequence of reading the markers.

Abstract: A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices.

Abstract: A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a component, and at least one terminal region for electrically connecting the component to the carrier when mounted to the seat, wherein a test portal is arranged at an outer surface of the carrier, and wherein one or more routing paths are arranged in the carrier for routing one or more electrical contacts arranged at the carrier to the test portal.

Abstract: A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices.

Abstract: A method for mounting a component to an electric circuit board (10), comprising: providing at least one cavity in the electric circuit board; arranging the component in the at least one cavity; and generating in the at least one cavity mechanical and/or electrical connections simultaneously to at least two locations of the component. A method for making an electric circuit board arrangement comprising at least one electric circuit board, comprising: providing at least one cavity and/or through-hole in the at least one electric circuit board; arranging the component in the at least one cavity and/or in a through-hole, the component being mechanically and/or electrically connectable by contact in the at least one cavity and/or through-hole; and stacking one or more electric circuit boards on top of the at least one electric circuit board and coupling the electric circuit boards by solderable terminal pads of the component.

Abstract: A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a component, and at least one terminal region for electrically connecting the component to the carrier when mounted to the seat, wherein a test portal is arranged at an outer surface of the carrier, and wherein one or more routing paths are arranged in the carrier for routing one or more electrical contacts arranged at the carrier to the test portal.

Abstract: A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices.

Abstract: A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference formed on an outer layer with the reference electrically connected to the pattern. The apparatus includes a holder for the board, an electrical input device that moves into and out of connection with the reference when the board is in the holder, with the input device adapted to provide a signal to the reference, and an electrical output probe configured to move into and out of electrical connection with the pattern when the board is in the holder. The output probe is adapted to receive at least one signal from the pattern when a signal is provided to the reference, such that the signal received by the output probe conveys layer-to-layer misregistration between the inner layer and the outer layer.

Abstract: A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference formed on an outer layer with the reference electrically connected to the pattern. The apparatus includes a holder for the board, an electrical input device that moves into and out of connection with the reference when the board is in the holder, with the input device adapted to provide a signal to the reference, and an electrical output probe configured to move into and out of electrical connection with the pattern when the board is in the holder. The output probe is adapted to receive at least one signal from the pattern when a signal is provided to the reference, such that the signal received by the output probe conveys layer-to-layer misregistration between the inner layer and the outer layer.

Abstract: A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference formed on an outer layer with the reference electrically connected to the pattern. The apparatus includes a holder for the board, an electrical input device that moves into and out of connection with the reference when the board is in the holder, with the input device adapted to provide a signal to the reference, and an electrical output probe configured to move into and out of electrical connection with the pattern when the board is in the holder. The output probe is adapted to receive at least one signal from the pattern when a signal is provided to the reference, such that the signal received by the output probe conveys layer-to-layer misregistration between the inner layer and the outer layer.

Abstract: This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second conductive layers. A hollow conductive via is formed through the insulator, the conductive via electrically connects the first and second conductive layers. At least one conductive trace electrically connects the hollow conductive via to at least one of the first and second conductive layers. The method further includes forming a channel in the insulator adjacent to the hollow conductive via and the channel surrounds the via. Wherein the channel extends at least part way between the first and second conductive layers, the at least one conductive trace bridges the channel, and the via is isolated from the insulator by the surrounding channel formed adjacent to the hollow conductive via.

Abstract: Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier.

Abstract: A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer.

Abstract: A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer.

Abstract: This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

Abstract: Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier.

Abstract: This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

Abstract: Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier.