Patents by Inventor Anthony Barbara

Anthony Barbara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11622183
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: April 4, 2023
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (MALTA) LTD
    Inventors: Roberto Brioschi, Paul Anthony Barbara
  • Publication number: 20210204049
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Application
    Filed: March 17, 2021
    Publication date: July 1, 2021
    Applicants: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (MALTA) LTD
    Inventors: Roberto BRIOSCHI, Paul Anthony BARBARA
  • Patent number: 11032629
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: June 8, 2021
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (MALTA) LTD
    Inventors: Roberto Brioschi, Paul Anthony Barbara
  • Publication number: 20190141426
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Inventors: Roberto BRIOSCHI, Paul Anthony BARBARA
  • Patent number: 10225635
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: March 5, 2019
    Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd
    Inventors: Roberto Brioschi, Alex Gritti, Kevin Formosa, Paul Anthony Barbara
  • Publication number: 20170006368
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Application
    Filed: April 29, 2016
    Publication date: January 5, 2017
    Inventors: Roberto BRIOSCHI, Alex GRITTI, Kevin FORMOSA, Paul Anthony BARBARA
  • Patent number: 7367481
    Abstract: A vehicle roof rack assembly (50) including a pair of clamp assemblies (11) that secure a roof rack bar (10) to the rails (12) of a vehicle having a roof over which the bar (10) is extend. Each clamp assembly (11) includes a pivotally mounted jaw member (26) that co-operates with a jaw (16) to engage the vehicle rail (12).
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: May 6, 2008
    Assignee: Roof Rack Industries Pty Ltd.
    Inventor: Anthony Barbara
  • Publication number: 20040211801
    Abstract: A vehicle roof rack assembly (50) including a pair of clamp assemblies (11) that secure a roof rack bar (10) to the rails (12) of a vehicle having a roof over which the bar (10) is extend. Each clamp assembly (11) includes a pivotally mounted jaw member (26) that co-operates with a jaw (16) to engage the vehicle rail (12).
    Type: Application
    Filed: January 30, 2004
    Publication date: October 28, 2004
    Applicant: Roof Rack Industries Pty Ltd
    Inventor: Anthony Barbara