Patents by Inventor Anthony Flannery
Anthony Flannery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240123448Abstract: An example of a flow cell includes a substrate and a reaction area defined in or over the substrate. The reaction area includes two angularly offset and non-perpendicular surfaces relative to a planar surface of the substrate, a polymeric hydrogel positioned over at least a portion of each of the two angularly offset and non-perpendicular surfaces; a first primer set attached to the polymeric hydrogel that is positioned over the portion of a first of the two angularly offset and non-perpendicular surfaces; and a second primer set attached to the polymeric hydrogel that is positioned over the portion of a second of the two angularly offset and non-perpendicular surfaces, wherein the first and second primer sets are orthogonal.Type: ApplicationFiled: September 28, 2023Publication date: April 18, 2024Inventors: Jeffrey S. Fisher, Anthony Flannery, Sahngki Hong, Brinda Kodira Cariappa, Lewis J. Kraft
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Patent number: 11937906Abstract: Systems and methods for monitoring blood flow metrics using a patch of a flexible substrate configured to attach to an area of skin over a blood vessel. The patch includes a plurality of light sources arranged on the substrate to form a matrix and a row of photodetectors disposed on the substrate substantially in parallel with the rows of LEDs. The patch includes an optical signal interface configured to drive each light source and to input an intensity signal at one of the photodetectors. The intensity signals are used to determine AC and DC components corresponding to each optical path. AC to DC component ratios are calculated for each optical path and used to determine ratio-of-ratio values. At least a subset of the ratio-of-ratio values are used to determine a biological metric or a cross-sectional area of the blood vessel.Type: GrantFiled: April 11, 2021Date of Patent: March 26, 2024Assignee: Alio, Inc.Inventors: Andrei Afanasiev, Forrest Miller, Francis Honore, Anthony Flannery
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Publication number: 20240016403Abstract: Systems and methods for monitoring blood flow metrics using a patch of a flexible substrate configured to attach to an area of skin over a blood vessel. The patch includes a plurality of light sources arranged on the substrate to form a matrix and a row of photodetectors disposed on the substrate substantially in parallel with the rows of LEDs. The patch includes an optical signal interface configured to drive each light source and to input an intensity signal at one of the photodetectors. The intensity signals are used to determine AC and DC components corresponding to each optical path. AC to DC component ratios are calculated for each optical path and used to determine ratio-of-ratio values. At least a subset of the ratio-of-ratio values are used to determine a biological metric or a cross-sectional area of the blood vessel.Type: ApplicationFiled: April 11, 2021Publication date: January 18, 2024Applicant: ALIO, INC.Inventors: Andrei AFANASIEV, Forrest Miller, Francis Honore, Anthony Flannery
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Publication number: 20230398503Abstract: A nanopore sensing system includes a cis well, a trans well, and a metal based membrane positioned between the cis and trans wells so that a channel defined in the metal based membrane fluidically connects the cis and trans wells. The metal based membrane has a thickness ranging from about 1 nm to about 3 nm and is selected from the group consisting of a metal oxide, a metal sulfide, a metal nitride, a metal phosphide, a metal arsenide, a metal antimonide, a metal selenide, and a metal telluride.Type: ApplicationFiled: June 9, 2023Publication date: December 14, 2023Inventors: Rajesh Kumar Sharma, Gerald Kreindl, Anthony Flannery
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Publication number: 20230139821Abstract: In an example method, a first functionalized layer is deposited over a resin layer including multi-depth depressions separated by interstitial regions, each depression including a deep portion and a shallow portion adjacent to the deep portion; a photoresist is deposited over the first functionalized layer; an ultraviolet light dosage is directed, through the resin layer, whereby a first photoresist portion generates an insoluble photoresist and a second photoresist portion becomes a soluble photoresist; the soluble photoresist is removed to expose a portion of the first functionalized layer; the portion of the first functionalized layer is removed to expose a portion of the resin layer; a second functionalized layer is deposited over the insoluble photoresist, and over the exposed portion of the resin layer; the insoluble photoresist is removed to expose the first functionalized layer; and the first functionalized layer or the second functionalized layer is removed from the interstitial regions.Type: ApplicationFiled: May 9, 2022Publication date: May 4, 2023Inventors: Jeffrey S. Fisher, Anthony Flannery, Sahngki Hong, Brinda Kodira Cariappa, Lewis J. Kraft
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Publication number: 20230137978Abstract: A metal film is formed over a resin layer including a plurality of multi-depth depressions (MDP) separated by interstitial regions, each MDP including a deep portion and an adjacent shallow portion. A sacrificial layer is formed over the metal film. The sacrificial layer and metal film are sequentially dry etched to expose a resin layer surface at the shallow portion and interstitial regions. Resin layer portions are removed i) at the shallow portion to form a depression region having a surface directly adjacent to a surface at the deep portion and ii) at the interstitial regions to form new interstitial regions surrounding the deep portion and the depression region. First functionalized layer is deposited over the metal film, depression region, and new interstitial regions. The metal film is removed from the deep portion. Second functionalized layer is deposited over the surface at the deep portion. New interstitial regions are polished.Type: ApplicationFiled: May 9, 2022Publication date: May 4, 2023Inventors: Jeffrey S. Fisher, Anthony Flannery, Sahngki Hong, Brinda Kodira Cariappa, Lewis J. Kraft, Brian D. Mather
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Publication number: 20230112203Abstract: Devices for sequencing biopolymers and methods of using the devices are disclosed. In one example, such a device has a nanopore, a plurality of wells and fluidic tunnels to allow a biopolymer to translocate in the device. In some embodiments, the device may include integrated electronics or micro-electromechanical systems, such as valves, bubble generators/annihilators or pressure pulse generators, to actively control fluidic/ionic/electric flows in the device.Type: ApplicationFiled: September 21, 2022Publication date: April 13, 2023Inventors: Boyan Boyanov, Craig Ciesla, Anthony Flannery, Gerald Kreindl, Rean Silke Musa, Darren Segale
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Publication number: 20220304586Abstract: A system, device and method for automatically and remotely acquiring sensor data from a wearable patch mounted on a patient. An example device implemented as a wearable patch includes a sensor assembly comprising a plurality of sensors configured to detect a corresponding plurality of sensory modalities and generate electrical signals representing the sensory modalities. A signal converter receives the electrical signals from the plurality of sensors and converts the signals to sensor data signals comprising a data representation of at least one of the electrical signals. A communications interface communicates the sensor data signals to a sensor data processing system.Type: ApplicationFiled: June 16, 2022Publication date: September 29, 2022Inventors: Francis Honore, Samit Kumar Gupta, David John Kuraguntla, James Reich, Anthony Flannery, Jr., Jivko Mihaylov
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Patent number: 11406274Abstract: A system, device and method for automatically and remotely acquiring sensor data from a wearable patch mounted on a patient. An example device implemented as a wearable patch includes a sensor assembly comprising a plurality of sensors configured to detect a corresponding plurality of sensory modalities and generate electrical signals representing the sensory modalities. A signal converter receives the electrical signals from the plurality of sensors and converts the signals to sensor data signals comprising a data representation of at least one of the electrical signals. A communications interface communicates the sensor data signals to a sensor data processing system.Type: GrantFiled: September 12, 2017Date of Patent: August 9, 2022Assignee: Alio, Inc.Inventors: Francis Honore, Samit Kumar Gupta, David John Kuraguntla, James Reich, Anthony Flannery, Jr., Jivko Mihaylov
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Publication number: 20180070841Abstract: A system, device and method for automatically and remotely acquiring sensor data from a wearable patch mounted on a patient. An example device implemented as a wearable patch includes a sensor assembly comprising a plurality of sensors configured to detect a corresponding plurality of sensory modalities and generate electrical signals representing the sensory modalities. A signal converter receives the electrical signals from the plurality of sensors and converts the signals to sensor data signals comprising a data representation of at least one of the electrical signals. A communications interface communicates the sensor data signals to a sensor data processing system.Type: ApplicationFiled: September 12, 2017Publication date: March 15, 2018Applicant: GrafWorx, Inc.Inventors: Francis Honore, Samit Kumar Gupta, David John Kuraguntla, James Reich, Anthony Flannery, JR., Jivko Mihaylov
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Patent number: 9291638Abstract: A method for providing acceleration data with reduced substrate-displacement bias includes receiving in an accelerometer an external acceleration, determining the acceleration data with reduced substrate displacement bias in a compensation portion in response to a first and a second displacement indicators from a MEMS transducer, and, in response to substrate compensation factors from a MEMS compensation portion, outputting the acceleration data with reduced substrate displacement bias, wherein the first displacement indicator and the second displacement indicator are determined by the MEMS transducer relative to a substrate in response to the external acceleration and to a substrate displacement, and wherein the substrate compensation factors are determined by the MEMS compensation portion relative to the substrate in response to the substrate displacement.Type: GrantFiled: January 18, 2013Date of Patent: March 22, 2016Assignee: mCube, Inc.Inventors: Raymond Merrill, Jr., Anthony Flannery, Jr., Shingo Yoneoka
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Publication number: 20070012653Abstract: A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame is provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.Type: ApplicationFiled: July 28, 2005Publication date: January 18, 2007Inventors: Steven Nasiri, Anthony Flannery
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Publication number: 20060228831Abstract: A method and system for releasing MEMS cover-structure on a wafer is disclosed. It includes at least one MEMS wafer structure made up of two wafers, one protective cover, and one containing at least one MEMS feature that are bonded together by various standard wafer bonding means. Also, one wafer substrate with patterned aluminum features and input/output pads. The method and system comprise providing for a built in channels between the said first cover wafer, and second said MEMS wafer allowing for a saw blade to cut a channel into the cover wafer, while the MEMS wafer providing for protection against saw slurries to get over the contact pad area on the said substrate wafer. Providing a tab area over the at least one bond pad and the dicing of the tab area to remove at least a portion of tab area above the at least one bond pad. A method and system of using industry dicing techniques to release the MEMS cover-structure from the substrate is disclosed.Type: ApplicationFiled: March 29, 2005Publication date: October 12, 2006Inventors: Steven Nasiri, Anthony Flannery, Martin Lim
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Publication number: 20060219006Abstract: A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane is provided. The dual-axis sensor includes a first subsensor for measuring the X component of angular velocity, and a second subsensor for measuring the Y component of angular velocity. The first subsensor and the second subsensor are contained within a single hermetic seal within the dual-axis sensor.Type: ApplicationFiled: November 18, 2005Publication date: October 5, 2006Inventors: Steven Nasiri, Joseph Seeger, Martin Lim, Anthony Flannery, Alexander Castro
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Publication number: 20060208326Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.Type: ApplicationFiled: March 18, 2005Publication date: September 21, 2006Inventors: Steven Nasiri, Anthony Flannery
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Publication number: 20050166677Abstract: A MEMS assembly having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided.Type: ApplicationFiled: February 2, 2004Publication date: August 4, 2005Inventors: Steven Nasiri, Anthony Flannery
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Publication number: 20050170656Abstract: A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.Type: ApplicationFiled: February 2, 2004Publication date: August 4, 2005Inventors: Steven Nasiri, Anthony Flannery
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Publication number: 20050082252Abstract: A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame is provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.Type: ApplicationFiled: October 20, 2003Publication date: April 21, 2005Inventors: Steven Nasiri, Anthony Flannery
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Patent number: 6517736Abstract: A micro-fluidic device is disclosed with a gasket layer laminated between a silicon wafer patterned with channels and a glass wafer. The gasket layer is formed in two parts. A first portion of the gasket layer is formed on the inner walls of the channels and along the channel edges. A complimentary gasket is formed on the glass wafer. The silicon wafer and the glass wafer are anodically bonded together through their respective surface to enclosed channels or portions thereof. The fluidic properties of the micro-fluidic devices are altered depending on the gasket material that is used. In the preferred embodiments of the invention, the gasket material is selected from the group consisting of silicon carbide and silicon nitride.Type: GrantFiled: October 14, 1999Date of Patent: February 11, 2003Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Anthony Flannery, Nicholas J. Mourlas