Patents by Inventor Anthony Ingham

Anthony Ingham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bed with magnetic couplers
    Patent number: 11992129
    Abstract: A magnetic coupler for attaching a mattress to a bed foundation includes a magnet assembly, a target assembly, and a shunt. The magnet assembly includes a housing and a magnet, wherein the housing is configured to couple the magnet to the mattress. The target assembly is configured to couple a target to the foundation. The shunt is disposed within the housing of the magnet assembly or in the mattress. The magnet assembly and the target assembly are releasably attached when the magnet is magnetically coupled to the target.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: May 28, 2024
    Assignee: Sleep Number Corporation
    Inventors: Craig Peterson, Dominic Grey, Jeff Ingham, Anthony John Shakal
  • SOLDER ALLOY
    Publication number: 20160107267
    Abstract: An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities.
    Type: Application
    Filed: December 22, 2015
    Publication date: April 21, 2016
    Applicant: ALPHA METALS, INC.
    Inventors: Anthony Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher
  • THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
    Publication number: 20070145546
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Application
    Filed: March 6, 2007
    Publication date: June 28, 2007
    Applicant: FRY'S METALS, INC.
    Inventors: Brian Lewis, Bawa Singh, John Laughlin, David Kyaw, Anthony Ingham, Attiganal Sreeram, Leszek Hozer, Michael Liberatore, Gerard Minogue