Abstract: A method of fabricating a semiconductor device so as to cause the device to have a desired transfer characteristic. Computations may be performed that predict a transfer characteristic of the semiconductor device for each of a plurality of different sets of values of available control parameters that may be used during the fabrication of the semiconductor device. A set of values of available control parameters that the computations predict will cause the semiconductor device to substantially provide the desired transfer characteristic may be identified, and the semiconductor device may be fabricated based on these identified values.

Abstract: A system and process for stamping parts having tolerances below 1000 nanometers. The inventive system and process is particularly suited for producing optoelectronic parts. The system includes a stamping press and one or a progression of stamping stations for supporting a punch and die. The stamping stations are designed to maintain substantial alignment of the punch and die with minimal moving components. The stamping station includes a shaft for rigidly guiding the punch to the die. The stamping press is capable of providing the punch with the necessary force to perform the stamping operations. The system includes an interface system for interfacing the force of the press with the punch, while simultaneously structurally decoupling the press from the punch. The system also includes a locating sub-plate, for locating the stamping station in alignment relative to each other, and means for in-line machine stock material before entry into the stamping stations.

Abstract: An optoelectronic assembly having components designed to be fabricated on a stamping process capable of producing parts having tolerances below 1000 nanometers. The optoelectronic assembly includes ferrules and sleeves. The ferrules can include two identical half ferrules that are forged and assembled together to form the ferrule body. The ferrules can also be designed to be alternatively produced by forming processes or produced by a combination of forging and forming processes. The pair of ferrules supporting one or more optical fibers are guided together by a high precision split sleeve for coupling the fibers together.

Abstract: A method of fabricating a semiconductor device so as to cause the device to have a desired transfer characteristic. Computations may be performed that predict a transfer characteristic of the semiconductor device for each of a plurality of different sets of values of available control parameters that may be used during the fabrication of the semiconductor device. A set of values of available control parameters that the computations predict will cause the semiconductor device to substantially provide the desired transfer characteristic may be identified, and the semiconductor device may be fabricated based on these identified values.

Abstract: A QCSE device may have a semiconductor quantum well structure, with an energy band profile defined by a broken-symmetry quantum well potential V(x). The quantum well potential V(x) may be identified by adaptive numerical searches performed by a processing system, which uses adaptive algorithms to numerically optimize the quantum well potential, so as to most closely match a desired optical response of the QCSE device to incident optical radiation. A nanophotonic device may include a plurality of dielectric scattering centers distributed within a substantially uniform medium in an aperiodic, broken-symmetry spatial configuration. The spatial configuration of the dielectric elements may be numerically computed and optimized using iterative techniques, so as to most closely generate a desired target function response from the nanophotonic device.

Abstract: A sense-amplifier based on current-source-evaluation. Compared to conventional sense-amplifiers, a design based on static-current sources scales better to small transistor geometries. The design has lower power consumption, reduced noise, and improved clock scaling.

Abstract: An optoelectronic assembly having components designed to be fabricated on a stamping process capable of producing parts having tolerances below 1000 nanometers. The optoelectronic assembly includes ferrules and sleeves. The ferrules can include two identical half ferrules that are forged and assembled together to form the ferrule body. The ferrules can also be designed to be alternatively produced by forming processes or produced by a combination of forging and forming processes. The pair of ferrules supporting one or more optical fibers are guided together by a high precision split sleeve for coupling the fibers together.

Abstract: A system and process for stamping parts having tolerances below 1000 nanometers. The inventive system and process is particularly suited for producing optoelectronic parts. The system includes a stamping press and one or a progression of stamping stations for supporting a punch and die. The stamping stations are designed to maintain substantial alignment of the punch and die with minimal moving components. The stamping station includes a shaft for rigidly guiding the punch to the die. The stamping press is capable of providing the punch with the necessary force to perform the stamping operations. The system includes an interface system for interfacing the force of the press with the punch, while simultaneously structurally decoupling the press from the punch. The system also includes a locating sub-plate, for locating the stamping station in alignment relative to each other, and means for in-line machine stock material before entry into the stamping stations.

Abstract: A sense-amplifier based on current-source-evaluation. Compared to Conventional sense-amplifiers, a design based on static-current sources scales better to small transistor geometries. The design has lower power consumption, reduced noise, and improved clock scaling.