Patents by Inventor Anthony M. Pasqualoni

Anthony M. Pasqualoni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer plug for electronic packages
    Patent number: 5477008
    Abstract: There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: December 19, 1995
    Assignee: Olin Corporation
    Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Francis S. Jewell, Paul R. Hoffman, George Brathwaite, Richard McNabb, German Ramirez
  • Anodized aluminum electronic package components
    Patent number: 5403975
    Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 80 amps per square foot and then allowed to gradually decrease as a function of oxide growth.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: April 4, 1995
    Assignee: Olin Corporation
    Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Satish K. Jalota, Andrew J. Brock
  • Metal electronic package with reduced seal width
    Patent number: 5399805
    Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: March 21, 1995
    Assignee: Olin Corporation
    Inventors: Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman
  • Metal electronic package with reduced seal width
    Patent number: 5324888
    Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: June 28, 1994
    Assignee: Olin Corporation
    Inventors: Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman
  • Process for producing black integrally colored anodized aluminum components
    Patent number: 5066368
    Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 70 amps per square foot and then allowed to gradually decrease as a function of oxide growth while the voltage is maintained in excess of 70 volts.
    Type: Grant
    Filed: August 17, 1990
    Date of Patent: November 19, 1991
    Assignee: Olin Corporation
    Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Satish K. Jalota, Andrew J. Brock
  • Metal electronic package
    Patent number: 4897508
    Abstract: A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.
    Type: Grant
    Filed: February 10, 1988
    Date of Patent: January 30, 1990
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Sheldon H. Butt, Jacob Crane, Anthony M. Pasqualoni, Edward F. Smith