Abstract: A quasi-switched, multi-band, high-power amplifier includes an input matching network, a low band path, a high band path, and an output matching network. The input matching network includes a single input port that is configured to receive an input signal. The input signal includes at least one tone within a specified frequency band. The low band path is configured, when the specified frequency band is a low frequency band, to amplify the input signal to generate a low band amplified signal. The high band path is configured, when the specified frequency band is a high frequency band, to amplify the input signal to generate a high band amplified signal. The output matching network includes a single output port and is configured to filter at least one of the low band amplified signal and the high band amplified signal into a load through the single output port.

Abstract: A directional coupler including input line has a first coupler portion that extends between an input port and transmitted port. The coupler also has an output line having a second coupler portion connected to an output port and that extends in a same direction as the first coupler portion and is directly above or below the first coupler portion and a substrate. The coupler also includes a metal ground plane disposed over the substrate and below the input and output lines, the metal ground plane including a patterned region disposed below first and second coupler portions and including cross members that extend in a direction perpendicular to the first and second coupler portions.

Abstract: An integrated circuit system having: (A) a semiconductor chip with a signal strip conductor disposed on an upper surface of the chip; an active semiconductor device disposed of the upper surface of the chip electrically connected to the signal strip conductor; and a first ground plane conductor disposed on a bottom surface of the chip disposed under the signal strip conductor; and (B) a support structure having: a second ground plane disposed over, and separated from, the signal strip conductor by a dielectric region between the second ground plane and the signal strip conductor on the chip; a signal contact disposed on the bottom surface of the support structure displaced, electrically insulated, from the second ground plane conductor, and electrically connected to a portion of the signal strip conductor. The signal strip conductor, the first ground plane conductor, and the second ground plane conductor provide a stripline microwave transmission line.

Abstract: A quasi-switched, multi-band, high-power amplifier includes an input matching network, a low band path, a high band path, and an output matching network. The input matching network includes a single input port that is configured to receive an input signal. The input signal includes at least one tone within a specified frequency band. The low band path is configured, when the specified frequency band is a low frequency band, to amplify the input signal to generate a low band amplified signal. The high band path is configured, when the specified frequency band is a high frequency band, to amplify the input signal to generate a high band amplified signal. The output matching network includes a single output port and is configured to filter at least one of the low band amplified signal and the high band amplified signal into a load through the single output port.