Patents by Inventor Anthony Schepis

Anthony Schepis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11862497
    Abstract: A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: January 2, 2024
    Assignee: Tokyo Electron Limited
    Inventors: H. Jim Fulford, Anthony Schepis, Anton J. Devilliers
  • Publication number: 20230367217
    Abstract: A method for patterning a substrate in which a patterned photoresist structure can be formed on the substrate, the patterned photoresist structure having a sidewall. A conformal layer of spacer material can be deposited on the sidewall. The patterned photoresist structure can then be removed from the substrate, leaving behind the spacer material. Then, the substrate can be directionally etched using the sidewall spacer as an etch mask to form the substrate having a target critical dimension.
    Type: Application
    Filed: July 18, 2023
    Publication date: November 16, 2023
    Applicant: Tokyo Electron Limited
    Inventors: Jodi GRZESKOWIAK, Anthony SCHEPIS, Anton DEVILLIERS
  • Patent number: 11782346
    Abstract: A method for patterning a substrate in which a patterned photoresist structure can be formed on the substrate, the patterned photoresist structure having a sidewall. A conformal layer of spacer material can be deposited on the sidewall. The patterned photoresist structure can then be removed from the substrate, leaving behind the spacer material. Then, the substrate can be directionally etched using the sidewall spacer as an etch mask to form the substrate having a target critical dimension.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: October 10, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Jodi Grzeskowiak, Anthony Schepis, Anton Devilliers
  • Publication number: 20210351053
    Abstract: A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.
    Type: Application
    Filed: July 21, 2021
    Publication date: November 11, 2021
    Applicant: Tokyo Electron Limited
    Inventors: H. Jim FULFORD, Anthony SCHEPIS, Anton J. DEVILLIERS
  • Patent number: 11133206
    Abstract: A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: September 28, 2021
    Assignee: Tokyo Electron Limited
    Inventors: H. Jim Fulford, Anthony Schepis, Anton J. deVilliers
  • Publication number: 20210088907
    Abstract: A method for patterning a substrate in which a patterned photoresist structure can be formed on the substrate, the patterned photoresist structure having a sidewall. A conformal layer of spacer material can be deposited on the sidewall. The patterned photoresist structure can then be removed from the substrate, leaving behind the spacer material. Then, the substrate can be directionally etched using the sidewall spacer as an etch mask to form the substrate having a target critical dimension.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 25, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Jodi GRZESKOWIAK, Anthony SCHEPIS, Anton DEVILLIERS
  • Publication number: 20200328102
    Abstract: A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique identifier.
    Type: Application
    Filed: July 31, 2019
    Publication date: October 15, 2020
    Applicant: Tokyo Electron Limited
    Inventors: Anthony SCHEPIS, Anton J. deVILLIERS, H. Jim FULFORD
  • Publication number: 20200328103
    Abstract: A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.
    Type: Application
    Filed: July 31, 2019
    Publication date: October 15, 2020
    Applicant: Tokyo Electron Limited
    Inventors: H. Jim FULFORD, Anthony SCHEPIS, Anton J. deVILLIERS
  • Patent number: 8958886
    Abstract: An article for transcutaneously applying electrical stimulation to sensory receptors. The article is a support to which an electrode pair, a positive and corresponding negative electrode, is attached. Leads are electrically attached to each of the positive and negative electrodes, wherein each lead has an insulated coating. A controller is electrically attached to the leads for delivering monophasic or biphasic electrical stimulation at a single frequency. A power supply is electrically connected to the controller, and may be attached to the support. The article may be a sock, a glove, a harness or an insole.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: February 17, 2015
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Eric Anthony Schepis, Matthew John Valaskey, Shawn Jeffery Sullivan, Martha Lillian Tate, Kaiyuan Yang, Martin S Shamis, WonYeong Sohn
  • Publication number: 20140188194
    Abstract: The article is a support to which an electrode pair, a positive and corresponding negative electrode, is attached. Leads are electrically attached to each of the positive and negative electrodes, wherein each lead has an insulated coating. A controller is electrically attached to the leads for delivering monophasic or biphasic electrical stimulation at a single frequency. A power supply is electrically connected to the controller, and may be attached to the support. The article may be a sock, a glove, a harness or an insole.
    Type: Application
    Filed: December 16, 2013
    Publication date: July 3, 2014
    Applicant: Kimberly-Clark Worldwide, Inc.
    Inventors: Eric Anthony Schepis, Matthew John Valaskey, Shawn Jeffery Sullivan, Martha Lillian Tate, Kaiyuan Yang, Martin S. Shamis, WonYeong Sohn
  • Patent number: 6872301
    Abstract: A high shear rotating disc filter having a hollow interior and constructed of a porous material such as sintered metal or ceramic with finely structured openings. The disc is mounted and secured onto a hollow shaft. The hollow shaft is connected to a vacuum source, external to the filter, that allows for the passage of the filtrate to a receiver. There are elongated slots in the wall of the shaft which provide the passage of filtrate from the disc. The shaft provides rotational force for the discs.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: March 29, 2005
    Inventor: Anthony Schepis
  • Patent number: 6663290
    Abstract: A bearing with shallow grooves on the surface of the rolling element. In addition, pockets of lubricant are carried in its own internal structure via a network of through-holes crossing at its center which release lubricant to the grooves and surface of the rolling element upon the rotation of the bearing assembly.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: December 16, 2003
    Inventor: Anthony Schepis
  • Publication number: 20030116496
    Abstract: A high shear rotating disc filter having a hollow interior and constructed of a porous material such as sintered metal or ceramic with finely structured openings. The disc is mounted and secured onto a hollow shaft. The hollow shaft is connected to a vacuum source, external to the filter, that allows for the passage of the filtrate to a receiver. There are elongated slots in the wall of the shaft which provide the passage of filtrate from the disc. The shaft provides rotational force for the discs.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventor: Anthony Schepis
  • Patent number: 6435431
    Abstract: A powderizing assembly includes a product line for receiving product sized powderized material from a powderizing mill, and a purger assembly for receiving non-product sized material from the mill. Non-product sized material is periodically removed from the mill and fed to the purger. The purger assembly includes a purge line in parallel with the product line for receiving material from the mill. The purge line includes a cyclone separator and a filter. A first valve is operable to direct material from the mill to one of the product line or the purge line. The first valve and a second valve are operable to isolate the product line from the purge line.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: August 20, 2002
    Assignee: Sturtevant, Inc.
    Inventors: William Chapman, Jr., Anthony Schepis