Abstract: The arrangement comprises a support at which there is mounted an induction loop through which flows a high-frequency alternating current. By displacing the support or the circuit board possessing the contact pins which are to be soldered, a multiplicity of contact pins at which contact is to be made are simultaneously brought together with the solder material and the solder eyelets of the contact locations into the range of influence of the magnetic alternating field. By appropriately constructing the induction loop there is obtained a simultaneous uniform heating of the contact pins and the contact locations. The arrangement thus renders possible a simultaneous faultless soldering of the contact pins of one or a number of pin rows of multipoint connectors mounted at the circuit boards.

Abstract: To improve the solderability of the terminals or connections of integrated circuit components (IC-components) with parallel connection rows these must be pre-tin plated. An apparatus is disclosed which immerses the connections or terminals to be pre-tin plated as deeply as possible into the solder bath without exposing the components to impermissible thermal loads. This is obtained in that the components which are to be initially or pre-tin plated are tilted about an axis extending parallel to the terminal or connection row in a manner such that the connections of a row are simultaneously immersed into the solder bath.