Abstract: An apparatus for coating board-shaped articles, especially printed circuit boards, is described which comprises at least one coating station having a pouring table for coating one surface of the printed circuit boards with preferably UV-hardenable plastics, lacquer or the like, and, adjoining that station, a vapor-removal and drying station having a vapor-removal drier for the removal of vapor from and drying of the coated surfaces of the printed circuit boards in the stream of hot air. The vapor-removal and drying station has an air processing module which is arranged in a housing which adjoins the entrance side of the housing of the vapor-removal drier and extends over the free space above the pouring table.

Abstract: The present invention is directed to a transport apparatus for thin, board-shaped substrates, for example printed circuit boards, which are conveyed through a coating installation and the like. In order to simplify manipulation during conveying, there is provided a frame (1) for holding a substrate (7), tensioning elements (4) being arranged spaced from one another on frame members (2), lying opposite one another, of the frame (1), which tensioning elements (4) engage the edge of the substrate and tension the substrate, the frame (1) being provided with a device (16) which serves to provide connection to a conveyor belt or the like. The tension springs (4) exert a tension away from the substrate (7) in the direction of the plane of the thin substrate to avoid sagging of the substrate. FIG. (1) illustrates the transport apparatus.

Abstract: A method and an apparatus for coating printed circuit boards on both sides are described in which the printed circuit boards are transported through several consecutive processing stations of a coating installation. In a first coating station, one side of the printed circuit boards is wet-coated with preferably UV-hardenable plastics and the printed circuit boards are subjected to vapour-removal and drying in a first vapour-removal and drying station. The printed circuit boards are turned and, in a second coating station, their second side is wet-coated with preferably UV-hardenable plastics and then are subjected to vapour-removal and drying in a second vapour-removal and drying station. The boards are finally transferred from the coating installation to other processing apparatuses for further processing. In the coating operation, the printed circuit boards are transported in opposite directions through the two coating stations which are arranged side by side in two parallel lines of apparatus.