Patents by Inventor Antonio De La Rosa

Antonio De La Rosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11552432
    Abstract: A shield for a cable attachment system for attaching a cable to a component having a ball grid array (BGA). The shield may comprise an outer conductive surface, a first end configured to be coupled to a surface of the component, a second end that receives the cable, and an inner non-conductive material received within the shield adjacent the first end and encasing the connection of the cable to the BGA of the component. The cable may be configured to be coupled to the BGA of the component.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 10, 2023
    Assignee: High Speed Interconnects, LLC
    Inventors: Antonio De La Rosa, Todd Albertson
  • Publication number: 20220313069
    Abstract: A cable assembly, comprising a component, a cable, a rigid adhesive and a flexible adhesive. The cable may be coupled to the component. The rigid adhesive may be applied to cover the connection of the cable to the component. The flexible adhesive may be applied to cover the rigid adhesive. The component may comprise a ball grid array (BGA) and the cable may be coupled to the BGA. A hypodermic tubing may be applied over a portion of the rigid adhesive.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Inventors: Antonio De La Rosa, Todd Albertson
  • Publication number: 20210153344
    Abstract: A foldable modular flex circuit for attaching to at least one component. The flex circuit may comprise a central area and at least one tab depending from the central area. The central area may comprise a cable attachment section configured to electrically couple to at least one coaxial cable. A first tab may depend from the central area and is configured to electrically couple to a ball grid array (BGA) of the component. A second pair of tabs may depend from the central area and are configured to electrically couple to an additional at least one component, wherein each tab depends substantially perpendicular from the central area.
    Type: Application
    Filed: January 28, 2021
    Publication date: May 20, 2021
    Inventors: Antonio De La Rosa, Todd Albertson
  • Patent number: 10939545
    Abstract: A foldable modular flex circuit for attaching to at least one component. The flex circuit may comprise a central area and at least one tab depending from the central area. The central area may comprise a cable attachment section configured to electrically couple to at least one coaxial cable. A first tab may depend from the central area and is configured to electrically couple to a ball grid array (BGA) of the component. A second pair of tabs may depend from the central area and are configured to electrically couple to an additional at least one component, wherein each tab depends substantially perpendicular from the central area.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: March 2, 2021
    Assignee: High Speed Interconnects, LLC
    Inventors: Antonio De La Rosa, Todd Albertson
  • Publication number: 20210052142
    Abstract: A cable attachment system and method for use with micro sensing component in a sterile environment. The cable attachment system may comprise a sensor, a cable connected to the sensor at a first end, a connector coupled to a second end of the cable, and a board coupled to the connector. A medical grade tubing may encase the connection of the sensor to the cable and a medical grade housing may encase the connection of the board to the connector and connected to the tubing. The medical grade housing and tubing are configured to create a sealed internal volume in the sterile environment.
    Type: Application
    Filed: August 23, 2020
    Publication date: February 25, 2021
    Inventors: Antonio De La Rosa, Todd Albertson
  • Publication number: 20210050691
    Abstract: A shield for a cable attachment system for attaching a cable to a component having a ball grid array (BGA). The shield may comprise an outer conductive surface, a first end configured to be coupled to a surface of the component, a second end that receives the cable, and an inner non-conductive material received within the shield adjacent the first end and encasing the connection of the cable to the BGA of the component. The cable may be configured to be coupled to the BGA of the component.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 18, 2021
    Inventors: Antonio De La Rosa, Todd Albertson
  • Publication number: 20200260575
    Abstract: A foldable modular flex circuit for attaching to at least one component. The flex circuit may comprise a central area and at least one tab depending from the central area. The central area may comprise a cable attachment section configured to electrically couple to at least one coaxial cable. A first tab may depend from the central area and is configured to electrically couple to a ball grid array (BGA) of the component. A second pair of tabs may depend from the central area and are configured to electrically couple to an additional at least one component, wherein each tab depends substantially perpendicular from the central area.
    Type: Application
    Filed: February 10, 2020
    Publication date: August 13, 2020
    Inventors: Antonio De La Rosa, Todd Albertson
  • Patent number: 10096953
    Abstract: Methods and apparatus for a shielded and grounded cable assembly include a coaxial cable assembly having a uniform spacing between cables to pre-align the cable assembly in an array corresponding to a connection layout of at a source end. The cable assembly includes a plurality of coaxial cables with exposed shields that are commonly grounded to a drain wire. The cable assembly may also be configured to be connected vertically/perpendicularly to a ball grid array or edge connected to a circuit board.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: October 9, 2018
    Assignee: High Speed Interconnects, LLC
    Inventors: Donovan Finnestad, James Alexander Moss, Antonio De La Rosa, Todd Albertson