Patents by Inventor Antonio Tersalvi

Antonio Tersalvi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5152869
    Abstract: A process on a single insulating substrate for depositing in succession a thin layer of tantalium with high resistivity doped with nitrogen and oxygen, a less thin layer of titanium with low resistivity doped with nitrogen, a layer of palladium and a thick layer of gold. Selective chemical attacks of said layers then permit tracing of conducting lines, resistive lines with greater resistance and resistive lines with less resistance.
    Type: Grant
    Filed: December 11, 1990
    Date of Patent: October 6, 1992
    Assignee: Siemens Telecommunicazioni S.p.A.
    Inventors: Giampiero Ferraris, Antonio Tersalvi
  • Patent number: 4812388
    Abstract: It is described a process to obtain thin film lines by photolithography of thick resist and subsequent selective galvanic growth of gold which enables to obtain very thin lines (2-10 micron) with high definition, that is with nearly vertical walls and with a tolerance in the width of about 1 micron. Such results have been achieved by using polyimide as thick resist, by particular cure cycles of the same polyimide and by a particular dry etching of the polyimide layer to obtain seats in which afterwards the lines become grown.
    Type: Grant
    Filed: September 25, 1987
    Date of Patent: March 14, 1989
    Assignee: GTE Telecomunicazioni, S.p.A.
    Inventors: Giampiero Ferraris, Antonio Tersalvi