Abstract: A method of determining a target spatial coordinate using an apparatus comprising a movable hand-held probe, having a body and a pointing element for pointing the target spatial coordinate, and a portable base unit provided with line-of-sight distance coupling means, wherein the hand-held probe is coupled to the base unit by said line-of-sight distance coupling means, coupled to the body at an attachment point, and wherein the base unit is provided with sensors providing measuring signals for measuring length or a change in length of the line-of-sight distance coupling means and rotation of said line-of-sight distance coupling means in at least one degree of freedom. Computer-controlled processing means are arranged for processing measuring signals. The method further comprising retrieving measuring signals wherein the target spatial coordinate is appointed from different orientations of the hand-held probe, and determining the target spatial coordinate from the measuring signals.

Abstract: An apparatus for pointing spatial coordinates, comprising a movable hand-held probe, having a pointing tip, and a portable base unit provided with a rotatably supported elongated arm, wherein the hand-held probe connects to the portable base unit by means of a cord or a wire via the elongated arm and wherein the base unit is provided with sensors for measuring length or a change in length of the cord or the wire and rotation of the arm in at least one degree of freedom, and computer-controlled processing means for processing measuring signals delivered by the sensors into position data of the hand-held probe.

Abstract: A method of determining a target spatial coordinate using an apparatus comprising a movable hand-held probe, having a body and a pointing element for pointing the target spatial coordinate, and a portable base unit provided with line-of-sight distance coupling means, wherein the hand-held probe is coupled to the base unit by said line-of-sight distance coupling means, coupled to the body at an attachment point, and wherein the base unit is provided with sensors providing measuring signals for measuring length or a change in length of the line-of-sight distance coupling means and rotation of said line-of-sight distance coupling means in at least one degree of freedom. Computer-controlled processing means are arranged for processing measuring signals. The method further comprising retrieving measuring signals wherein the target spatial coordinate is appointed from different orientations of the hand-held probe, and determining the target spatial coordinate from the measuring signals.

Abstract: A measuring device including a moveable measuring probe and sensors coupled to the measuring probe for providing position data of the measuring probe. The measuring probe is coupled, by a cord or a wire, to a first sensor for measuring a length or change in length of the cord or wire, and to a second sensor for measuring an angle or angular displacement of the cord or the wire. The obtained position data can be graphically represented and/or used for driving an automatic machining apparatus for producing a product corresponding to the measured data.

Abstract: A method of examining a wafer of crystalline semiconductor material by means of X-rays, in which method a surface of the wafer is scanned by means of an X-ray beam and secondary radiation generated by said X-ray beam is detected. Prior to the examination the surface of the wafer which is to be scanned by the X-ray beam during the examination is glued to a substrate, after which crystalline semiconductor material is removed at the side which is then exposed, removal taking place as far as the top layer which adjoins the surface. The top layer can thus be examined without the examination being affected by crystal defects or impurities present in layers of the wafer which are situated underneath the top layer.

Abstract: A method of examining a wafer of crystalline semiconductor material by means of X-rays, in which method a surface of the wafer is scanned by means of an X-ray beam and secondary radiation generated by said X-ray beam is detected. Prior to the examination the surface of the wafer which is to be scanned by the X-ray beam during the examination is glued to a substrate, after which crystalline semiconductor material is removed at the side which is then exposed, removal taking place as far as the top layer which adjoins the surface. The top layer can thus be examined without the examination being affected by crystal defects or impurities present in layers of the wafer which are situated underneath the top layer.