Patents by Inventor Anup Bhalia

Anup Bhalia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper bonding compatible bond pad structure and method
    Patent number: 8753972
    Abstract: A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: June 17, 2014
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: François Hébert, Anup Bhalia