Patents by Inventor Aofeng Qian

Aofeng Qian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring design method, wiring structure, and flip chip
    Patent number: 11887923
    Abstract: A wiring design method and a wiring structure for a package substrate in a flip chip, and a flip chip. The wiring design method includes: arranging bump pads in an array of rows and columns, wherein the bump pads are configured to bond with conductive bumps on a flip chip die, and the bump pads comprise signal pads and non-signal pads; providing the non-signal pad with a via hole; and using a layer of wiring to lead a subset of the signal pads out of an orthographic projection region of the flip chip die on the package substrate, wherein the subset of the signal pads is configured to carry all functional signals required by design specifications of the flip chip die for the array of the bump pads.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: January 30, 2024
    Assignee: NEXTVPU (SHANGHAI) CO., LTD.
    Inventors: Aofeng Qian, Gang Qin, Xinpeng Feng, Ji Zhou
  • WIRING DESIGN METHOD, WIRING STRUCTURE, AND FLIP CHIP
    Publication number: 20230154840
    Abstract: A wiring design method and a wiring structure for a package substrate in a flip chip, and a flip chip. The wiring design method includes: arranging bump pads in an array of rows and columns, wherein the bump pads are configured to bond with conductive bumps on a flip chip die, and the bump pads comprise signal pads and non-signal pads; providing the non-signal pad with a via hole; and using a layer of wiring to lead a subset of the signal pads out of an orthographic projection region of the flip chip die on the package substrate, wherein the subset of the signal pads is configured to carry all functional signals required by design specifications of the flip chip die for the array of the bump pads.
    Type: Application
    Filed: June 10, 2021
    Publication date: May 18, 2023
    Applicant: NEXTVPU (SHANGHAI) CO., LTD.
    Inventors: Aofeng Qian, Gang Qin, Xinpeng Feng, Ji Zhou