Abstract: A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.

Abstract: A polyacetal resin composition includes: in addition to a polyacetal resin as a principal component, 1.5 to 7% by mass of an ethylene-propylene-diene rubber; 0.5 to 3% by mass of a saponified ethylene-vinyl acetate copolymer; and 0.05 to 0.3% by mass of an ethylene-?-olefin copolymer.

Abstract: A polyacetal resin composition includes: in addition to a polyacetal resin as a principal component, 1.5 to 7% by mass of an ethylene-propylene-diene rubber; 0.5 to 3% by mass of a saponified ethylene-vinyl acetate copolymer; and 0.05 to 0.3% by mass of an ethylene-?-olefin copolymer.

Abstract: A pouched liquid food product from which a delicious dish can be cooked with a microwave oven without the color, smell, texture and the like of the food ingredients being harmed has a pouch having a zipper portion and a steam venting mechanism. The pouch is filled with a liquid food and sealed, and a liquid substance in the liquid food has a viscosity at 60° C. of 0.1 to 10 Pa·s.