Abstract: A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

Abstract: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

Abstract: An automated system for processing an end of a cable. The system includes: a cable delivery system; a cable processing module; a pallet supported by the cable delivery system; a drive wheel rotatably coupled to the pallet; a motor operatively coupled for driving rotation of the drive wheel; and an idler wheel rotatably coupled to the pallet and forming a nip with the drive wheel. The cable processing module includes cable processing equipment and a computer system. The computer system is configured to: (a) cause the drive wheel to rotate in a cable pushing direction to cause a specified length of cable to be inserted into the cable processing equipment; (b) activate the cable processing equipment to operate on the cable end; and (c) cause the drive wheel to rotate in a cable pulling direction to cause the length of cable to be removed from the cable processing equipment.

Abstract: An automated system for processing an end of a cable. The system includes: a cable delivery system; a cable processing module; a pallet supported by the cable delivery system; a drive wheel rotatably coupled to the pallet; a motor operatively coupled for driving rotation of the drive wheel; and an idler wheel rotatably coupled to the pallet and forming a nip with the drive wheel. The cable processing module includes cable processing equipment configured to perform an operation on an end of a cable and a computer system. The computer system is configured to: (a) cause the drive wheel to rotate in a cable pushing direction to cause a specified length of cable to be inserted into the cable processing equipment; (b) activate the cable processing equipment to perform an operation on the inserted end of the cable; and (c) cause the drive wheel to rotate in a cable pulling direction to cause the specified length of cable to be removed from the cable processing equipment.

Abstract: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

Abstract: A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.