Patents by Inventor Apolinar Alvarez

Apolinar Alvarez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for a microelectronic package and method of fabricating thereof
    Patent number: 8686551
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: April 1, 2014
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez, Jr.
  • SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF
    Publication number: 20120241960
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Application
    Filed: June 5, 2012
    Publication date: September 27, 2012
    Applicant: TESSERA, INC.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez, JR.
  • SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF
    Publication number: 20120056324
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Application
    Filed: October 20, 2011
    Publication date: March 8, 2012
    Applicant: TESSERA, INC.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez, JR.
  • Substrate for a microelectronic package and method of fabricating thereof
    Patent number: 8071424
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: December 6, 2011
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez, Jr.
  • SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF
    Publication number: 20100273293
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Application
    Filed: July 6, 2010
    Publication date: October 28, 2010
    Applicant: TESSERA, INC.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez, JR.
  • Polyceramic-coated tool for applying a flowable composition
    Patent number: 7779776
    Abstract: A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: August 24, 2010
    Assignee: Tessera, Inc.
    Inventors: Jesse Burl Thompson, Hilda Cantor Tadio, Salvador A. Tostado, Apolinar Alvarez, Jr.
  • Substrate for a microelectronic package and method of fabricating thereof
    Patent number: 7759782
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: July 20, 2010
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez, Jr.
  • Substrate for a microelectronic package and method of fabricating thereof
    Publication number: 20070235856
    Abstract: Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, Craig S. Mitchell, Apolinar Alvarez
  • Polyceramic-coated tool for applying a flowable composition
    Publication number: 20070015310
    Abstract: A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.
    Type: Application
    Filed: July 18, 2005
    Publication date: January 18, 2007
    Applicant: Tessera, Inc.
    Inventors: Jesse Thompson, Hilda Tadio, Salvador Tostado, Apolinar Alvarez