Abstract: A first heat sink has a first inner surface and a first outer surface, and has a first through hole. A second heat sink has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole. A semiconductor element is disposed within a clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink. A sealing member seals the semiconductor element within the clearance between the first inner surface and the second inner surface. A first hollow tube is made of metal, and connects the first through hole and the second through hole.

Abstract: An apparatus for carrying flat package integrated chips disposed in chip carriers has backing paper with a plurality of holes evenly spaced along the left and right sides of the paper and extending in a length-wise direction of the paper. At least one adhesive tape is attached to one face of the backing paper and holds the chip carriers. A plurality of chip carriers are adhered to the adhesive tape and are uniformly spaced along the paper in the length-wise direction. Each carrier has first and second alignment holes which are aligned with the holes in the backing paper.