Abstract: There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn—Zn alloy based solder particle (1), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film (2). There are also disclosed a solder material (6) in which a protective film (2) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn—Zn based solder particle (1), and a solder paste formed of this solder material (6) and the flux.

Abstract: A soldering method and apparatus in which there is provided a tight contact cover tightly contacting a portion (unused portion) of a re-flow panel other than its portion facing a substrate to be soldered in such a manner as to suppress a hot wind tending to turn around to a part setting surface to diminish the thermal energy loss as well as to prevent the circuit quality from being lowered by the solder.

Abstract: A method of attaching a lead part and a shield case for preventing a high-frequency signal from being leaked to a printed circuit board includes a solder coating step of coating solder so that the solder should cover the whole of an aperture provided through a printed circuit board into which a lead of the lead part is inserted and so that the solder should cover a part of an aperture provided through the printed circuit board into which an engagement portion of the shield case is inserted, a mounting step of inserting the lead of the lead part and the engagement portion of the shield case into the respective apertures to thereby mount the lead part and the shield case on the printed circuit board, and a soldering step of inserting the printed circuit board mounted with the lead part and the shield case into a reflowing furnace and melting the solder to thereby carry out soldering.

Abstract: A nozzle is able to reliably coat and solder a paste-like solder onto a joined member to be soldered, e.g., a plurality of surfaces of two surfaces or more including a joined corner of a metal plate and a base. In a nozzle (1A) according to the present invention, an inner wall length of a tip end portion (4) of a pipe forming a nozzle body (2) is selected such that one side portion (4A) side is reduced in length and an opposite portion (4B) side opposing the one side portion (4A) side is increased in length and an outlet (5) with a sunken opening (5A) is formed at the tip end portion (4) by progressively approaching an inner wall surface (4b) of the other side portion (4B) side to an inner wall surface (4a) of the one side portion (4A) side. Thus, a paste-like solder (S) to be escaped flows in an oblique direction different from the direction in which a fluid guided by the nozzle body (2) portion flows.