Patents by Inventor Arian Molenaar

Arian Molenaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing metal images or patterns on and/or below the surface of a substrate comprising a semiconducting light-sensitive compound
    Patent number: 4426442
    Abstract: Producing metal images or patterns on and/or below the surface of a substrate material comprising a semiconducting light-sensitive compound, such as titanium dioxide or zinc oxide which after exposure of a metal compound releases this metal in the form of nuclei. Exposure takes place in the solution of the metal compound by means of a moving beam of laser light whereby the nuclei pattern is directly "written". Thereafter, the nuclei image is intensified in known manner to produce a visible image or a conductive pattern, for example by means of an electroless plating solution. Use: the recording of information as well as the production of printed circuit boards.
    Type: Grant
    Filed: November 15, 1982
    Date of Patent: January 17, 1984
    Assignee: U.S. Philips Corporation
    Inventors: Arian Molenaar, Peter E. Wierenga
  • Bath for electroless depositing tin on substrates
    Patent number: 4269625
    Abstract: Method of currentless deposition of tin on a catalytic surface by means of a highly alkaline solution which contains stannous ions in a quantity of at least 0.20 mole/l and is used at temperatures of 60.degree. to 90.degree. C. The solution operates on the basis of the mechanism of disproportioning of stannous ions. The tin deposition is, however, accelerated by means of a strong reducing agent such as a hypophosphite.
    Type: Grant
    Filed: November 13, 1979
    Date of Patent: May 26, 1981
    Assignee: U.S. Philips Corporation
    Inventor: Arian Molenaar
  • Universal copper-plating solution
    Patent number: 4248633
    Abstract: A copper-plating bath suitable for reprographic uses and for making electrically conducting metal patterns with one of the redox pairs V.sup.2+ /V.sup.3+, Ti.sup.2+ /Ti.sup.3+, or Cr.sup.2+ /Cr.sup.3+ as a reducing agent, ascorbic acid with an acid acceptor, or the redox pair Fe.sup.2+ /Fe.sup.3+ together with an organic carboxylic acid and a complexing agent for cuprous ions.
    Type: Grant
    Filed: July 23, 1979
    Date of Patent: February 3, 1981
    Assignee: U.S. Philips Corporation
    Inventors: Godefridus H. C. Heijnen, Arian Molenaar
  • Electroless copper plating solutions
    Patent number: 4171225
    Abstract: Electroless copper plating bath containing a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formaldehyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained.
    Type: Grant
    Filed: April 21, 1978
    Date of Patent: October 16, 1979
    Assignee: U.S. Philips Corporation
    Inventors: Arian Molenaar, Henricus M. Van Den Bogaert, Jan Boven
  • Physical development process utilizing a physical developer containing a specific reducing agent, a thiol compound
    Patent number: 3960564
    Abstract: A solution for the selective electroless deposition of silver comprising as essential constituents silver salt, ammonium hydroxide and a reducer chosen from tartrate, formaldehyde or hydrazine and an organic compound having one or more cyclic or polar aliphatic groups on the one hand and an SH-group on the other hand.
    Type: Grant
    Filed: October 24, 1974
    Date of Patent: June 1, 1976
    Assignee: U.S. Philips Corporation
    Inventors: Arian Molenaar, Hendrik Jonker