Patents by Inventor Arimichi Okumura
Arimichi Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10118322Abstract: Provided is a sheet-shaped mold possessing a high strength and having a low breakage rate in demolding even in a case where the mold is thin and has a large-area. The sheet-shaped mold is prepared by combining a cured silicone rubber containing a polyorganosiloxane and a fiber for reinforcing the cured silicone rubber. The fiber may comprise a cellulose nanofiber. The sheet-shaped mold may have an uneven pattern on at least one surface (or side) thereof. The fiber may be surface-treated with a hydrophobizing agent. The fiber may forma nonwoven fabric, and the nonwoven fabric may be impregnated with the cured silicone rubber. The cured silicone rubber may comprise a two-component curable silicone rubber having a polydimethylsiloxane unit. The sheet-shaped mold may be a mold for nanoimprint lithography using a photo-curable resin.Type: GrantFiled: January 27, 2014Date of Patent: November 6, 2018Assignee: DAICEL CORPORATIONInventors: Tomoya Mizuta, Takuya Osaka, Katsuhiro Nakaguchi, Arimichi Okumura, Hiroto Miyake, Masaya Omura, Naotaka Nishio
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Publication number: 20160009006Abstract: Provided is a sheet-shaped mold possessing a high strength and having a low breakage rate in demolding even in a case where the mold is thin and has a large-area. The sheet-shaped mold is prepared by combining a cured silicone rubber containing a polyorganosiloxane and a fiber for reinforcing the cured silicone rubber. The fiber may comprise a cellulose nanofiber. The sheet-shaped mold may have an uneven pattern on at least one surface (or side) thereof. The fiber may be surface-treated with a hydrophobizing agent. The fiber may forma nonwoven fabric, and the nonwoven fabric may be impregnated with the cured silicone rubber. The cured silicone rubber may comprise a two-component curable silicone rubber having a polydimethylsiloxane unit. The sheet-shaped mold may be a mold for nanoimprint lithography using a photo-curable resin.Type: ApplicationFiled: January 27, 2014Publication date: January 14, 2016Applicant: DAICEL CORPORATIONInventors: Tomoya MIZUTA, Takuya OSAKA, Katsuhiro NAKAGUCHI, Arimichi OKUMURA, Hiroto MIYAKE, Masaya OMURA, Naotaka NISHIO
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Publication number: 20130249145Abstract: A method of manufacturing a composite molded article including a metal molded article and a resin molded article, the method including steps of: performing laser scanning on a joint surface of the metal molded article so as to form markings including straight lines and/or curved lines in a certain direction or in the different direction, and performing laser scanning so that the markings including the respective straight lines and/or the respective curved lines do not intersect with each other; and positioning, in a die, a portion including the joint surface of the metal molded article in which the marking is formed, to thereby perform insert-molding of a resin serving as the resin molded article.Type: ApplicationFiled: December 8, 2011Publication date: September 26, 2013Inventors: Arimichi Okumura, Yoshihiro Asami
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Patent number: 8470510Abstract: A polymer for lithographic purposes has at least a repeating structural unit represented by following General Formula (I). In Formula (I), R1, R3, R4, and R6 each independently represent hydrogen atom, a halogen atom, cyano group, an alkyl group, or a haloalkyl group; R2 and R5 each independently represent hydrogen atom, cyano group, etc.; X1 and X2 each independently represent single bond, or a substituted or unsubstituted bivalent alkylene, alkenylene, or cycloalkylene group, etc.; X3 and X4 each independently represent single bond or —CO—; R7, R8, R9, and R10 each independently represent hydrogen atom, an alkyl group, or a cycloalkyl group. The polymer for lithographic purposes shows good balance between line edge roughness (LER) and etching resistance and allows very fine and uniform patterning.Type: GrantFiled: June 1, 2009Date of Patent: June 25, 2013Assignee: Daicel Chemical Industries, Ltd.Inventors: Arimichi Okumura, Keizo Inoue, Kazuki Okamoto
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Patent number: 8148357Abstract: Resin particles are produced by adding a liquid material having a boiling point of 100° C. or higher to an aqueous dispersion of resin particles to yield a mixture, recovering a wet cake from the mixture by filtration, and drying the wet cake. A water-soluble material is preferably used as the liquid material. The liquid material may also be at least one compound selected from compounds listed in The Japanese Standards of Cosmetic Ingredients, The Japanese Cosmetic Ingredients Codex, The Pharmacopoeia of Japan, and The Japan's Specifications and Standards for Food Additives. According to this method, there are provided resin particles which are resistant to coagulation upon drying and are satisfactorily dispersible in other materials.Type: GrantFiled: September 13, 2005Date of Patent: April 3, 2012Assignee: Daicel-Evonik Ltd.Inventor: Arimichi Okumura
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Patent number: 7947369Abstract: Fine spherical thermoplastic resin particles are produced by preparing a resin composition including a matrix of a water-soluble material, and fine particles of a water-insoluble thermoplastic resin dispersed in the matrix, the fine particles and the matrix each being melted or softened in the resin composition; cooling and solidifying the resin composition under such conditions that the resin composition does not undergo deformation due to stress; and removing the water-soluble material by washing with water to thereby yield fine spherical particles containing the water-insoluble thermoplastic resin. This method has wide applicability, applies less loads on the environment, does not require special devices, can be easily conducted, and can efficiently produce such particles. The resulting particles are highly spherical.Type: GrantFiled: May 25, 2006Date of Patent: May 24, 2011Assignee: Daicel-Degussa Ltd.Inventor: Arimichi Okumura
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Publication number: 20110065044Abstract: A polymer for lithographic purposes has at least a repeating structural unit represented by following General Formula (I). In Formula (I), R1, R3, R4, and R6 each independently represent hydrogen atom, a halogen atom, cyano group, an alkyl group, or a haloalkyl group; R2 and R5 each independently represent hydrogen atom, cyano group, etc.; X1 and X2 each independently represent single bond, or a substituted or unsubstituted bivalent alkylene, alkenylene, or cycloalkylene group, etc.; X3 and X4 each independently represent single bond or —CO—; R7, R8, R9, and R10 each independently represent hydrogen atom, an alkyl group, or a cycloalkyl group. The polymer for lithographic purposes shows good balance between line edge roughness (LER) and etching resistance and allows very fine and uniform patterning.Type: ApplicationFiled: June 1, 2009Publication date: March 17, 2011Inventors: Arimichi Okumura, Keizo Inoue, Kazuki Okamoto
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Publication number: 20110040056Abstract: Disclosed is a process for the production of a polymer by polymerizing a monomer or monomers in a solvent to give a polymer solution; and bringing the polymer solution into contact with a poor solvent to precipitate the polymer and to remove impurities therefrom, in which the polymer solution is diluted with a solvent before being brought into contact with the poor solvent to precipitate the polymer. The polymerization solvent preferably has a coefficient of viscosity at 20° C. of 1 mPa·s or more. The dilution solvent preferably has a coefficient of viscosity at 20° C. of less than 1 mPa·s. The process enables efficient production of a polymer with good reproducibility in quality, which polymer contains less amounts of residual monomers and is useful as resist polymers, polymers for undercoat films of multilayer resists, polymers for anti-reflection coatings, and polymers for immersion topcoats.Type: ApplicationFiled: March 13, 2009Publication date: February 17, 2011Inventor: Arimichi Okumura
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Publication number: 20110027726Abstract: A polymer compound for photoresists contains alkali-soluble groups being protected by protecting groups capable of leaving with an acid, and is thereby insoluble or sparingly soluble in an alkaline developer, in which part or all of the protecting groups are multifunctional protecting groups each protecting two or more alkali-soluble groups. The alkali-soluble groups may be phenolic hydroxyl groups. The polymer compound may correspond to a polyol compound having an aliphatic group and an aromatic group bound to each other alternately, the aromatic group having an aromatic ring and two or more hydroxyl groups bound to the aromatic ring, except with phenolic hydroxyl groups of the polyol compound being protected by protecting groups capable of leaving with an acid. The polymer compound for photoresists can give a resist film with less line edge roughness (LER), while exhibiting excellent workability and resolution.Type: ApplicationFiled: April 2, 2009Publication date: February 3, 2011Inventors: Kiyoharu Tsutsumi, Arimichi Okumura
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Publication number: 20110027717Abstract: A photoresist composition contains a polyol compound and a vinyl ether compound, which polyol compound having an aliphatic group and an aromatic group bound alternately, and which aromatic group has an aromatic ring and two or more hydroxyl groups on the aromatic ring. The polyol compound can be prepared, for example, through an acid-catalyzed reaction, such as a Friedel-Crafts reaction, between an aliphatic polyol and an aromatic polyol. The aliphatic polyol is preferably an alicyclic polyol, whereas the aromatic polyol is preferably hydroquinone. The photoresist composition gives a resist film showing excellent alkali solubility and high etching resistance and thereby gives a resist pattern with less LER and less pattern collapse.Type: ApplicationFiled: April 2, 2009Publication date: February 3, 2011Inventors: Kiyoharu Tsutsumi, Arimichi Okumura
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Publication number: 20110027725Abstract: A polyol compound for photoresists has at least one aliphatic group and at least one aromatic group bound to each other alternately, in which the aromatic group has at least one aromatic ring and two or more hydroxyl groups bound to the aromatic ring. The polyol compound for photoresists can be prepared through an acid-catalyzed reaction, such as a Friedel-Crafts reaction, between an aliphatic polyol and an aromatic polyol. The aliphatic polyol is preferably an alicyclic polyol. The aromatic polyol is preferably hydroquinone. By protecting phenolic hydroxyl group(s) thereof with a protecting group capable of leaving with an acid, the polyol compound for photoresists gives a compound for photoresists. A photoresist composition containing this compound can form a resist pattern which shows less line edge roughness (LER), excels in resolution and etching resistance, and is fine and sharp.Type: ApplicationFiled: April 2, 2009Publication date: February 3, 2011Inventors: Kiyoharu Tsutsumi, Yoshinori Funaki, Arimichi Okumura
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Publication number: 20080199500Abstract: Resin particles are produced by adding a liquid material having a boiling point of 100° C. or higher to an aqueous dispersion of resin particles to yield a mixture, recovering a wet cake from the mixture by filtration, and drying the wet cake. A water-soluble material is preferably used as the liquid material. The liquid material may also be at least one compound selected from compounds listed in The Japanese Standards of Cosmetic Ingredients, The Japanese Cosmetic Ingredients Codex, The Pharmacopoeia of Japan, and The Japan's Specifications and Standards for Food Additives. According to this method, there are provided resin particles which are resistant to coagulation upon drying and are satisfactorily dispersible in other materials.Type: ApplicationFiled: September 13, 2005Publication date: August 21, 2008Applicant: DAICEL-DEGUSSA LTD.Inventor: Arimichi Okumura
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Publication number: 20060269749Abstract: Fine spherical thermoplastic resin particles are produced by preparing a resin composition including a matrix of a water-soluble material, and fine particles of a water-insoluble thermoplastic resin dispersed in the matrix, the fine particles and the matrix each being melted or softened in the resin composition; cooling and solidifying the resin composition under such conditions that the resin composition does not undergo deformation due to stress; and removing the water-soluble material by washing with water to thereby yield fine spherical particles containing the water-insoluble thermoplastic resin. This method has wide applicability, applies less loads on the environment, does not require special devices, can be easily conducted, and can efficiently produce such particles. The resulting particles are highly spherical.Type: ApplicationFiled: May 25, 2006Publication date: November 30, 2006Inventor: Arimichi Okumura