Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having all array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A method according to embodiments of the invention includes creating a three-dimensional profile of a scene, calculating a relative amount of light for each portion of the scene based on the three-dimensional profile, and activating a light source to provide a first amount of light to a first portion of the scene, and a second amount of light to a second portion of the scene. The first amount and the second amount are different. The first amount and the second amount are determined by calculating a relative amount of light for each portion of the scene.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A method includes capturing a first image of a scene, detecting a face in a section of the scene from the first image, and activating an infrared (IR) light source to selectively illuminate the section of the scene with IR light. The IR light source includes an array of IR light emitting diodes (LEDs). The method includes capturing a second image of the scene under selective IR lighting from the IR light source, detecting the face in the second image, and identifying a person based on the face in the second image.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A segmented light or optical power emitting device and an illumination device are described. The segmented device includes a die having a light or optical power emitting semiconductor structure that includes an active layer disposed between an n-layer and a p-layer. Trenches are formed in at least the semiconductor structure and separate the die into individually addressable segments. The active layer emits light or optical power having a first color point or spectrum. At least one wavelength converting layer is adjacent the die and converts the light or optical power to light or optical power having at least one second color point or spectrum and limits an energy ratio of the pump light or optical power that passes through the at least one wavelength converting layer unconverted to total light or optical power emitted by the light or optical power emitting device to less than 10%.

Abstract: Methods and systems for color error correction for a segmented LED array are disclosed. A method includes calculating a target luminance for LED segments in a segmented LED array based on an initial luminance pattern, determining a luminance ratio based on the target luminance, the luminance ratio defined as a ratio of a primary luminance value of the primary LED segment to a secondary luminance value of the at least one adjacent LED segment, and comparing the luminance ratio to a predefined threshold ratio. If the luminance ratio is greater than or equal to the predefined ratio, then the secondary luminance value of the at least one adjacent LED segment is maintained. If the luminance ratio is less than the predefined ratio, then the secondary luminance value of the at least one adjacent LED segment is increased.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A method of color error correction for a segmented LED array is disclosed. The method includes calculating a target luminance for LED segments in a segmented LED array based on an initial luminance pattern, determining a luminance ratio based on the target luminance, the luminance ratio defined as a ratio of a primary luminance value of the primary LED segment to a secondary luminance value of the at least one adjacent LED segment, and comparing the luminance ratio to a predefined threshold ratio. If the luminance ratio is greater than or equal to the predefined ratio, then the secondary luminance value of the at least one adjacent LED segment is maintained. If the luminance ratio is less than the predefined ratio, then the secondary luminance value of the at least one adjacent LED segment is increased.

Abstract: A method of color error correction for a segmented LED array is disclosed. The method includes calculating a target luminance for LED segments in a segmented LED array based on an initial luminance pattern, determining a luminance ratio based on the target luminance, the luminance ratio defined as a ratio of a primary luminance value of the primary LED segment to a secondary luminance value of the at least one adjacent LED segment, and comparing the luminance ratio to a predefined threshold ratio. If the luminance ratio is greater than or equal to the predefined ratio, then the secondary luminance value of the at least one adjacent LED segment is maintained. If the luminance ratio is less than the predefined ratio, then the secondary luminance value of the at least one adjacent LED segment is increased.

Abstract: A segmented light or optical power emitting device and an illumination device are described. The segmented device includes a die having a light or optical power emitting semiconductor structure that includes an active layer disposed between an n-layer and a p-layer. Trenches are formed in at least the semiconductor structure and separate the die into individually addressable segments. The active layer emits light or optical power having a first color point or spectrum. At least one wavelength converting layer is adjacent the die and converts the light or optical power to light or optical power having at least one second color point or spectrum and limits an energy ratio of the pump light or optical power that passes through the at least one wavelength converting layer unconverted to total light or optical power emitted by the light or optical power emitting device to less than 10%.

Abstract: A segmented light or optical power emitting device and an illumination device are described. The segmented device includes a die having a light or optical power emitting semiconductor structure that includes an active layer disposed between an n-layer and a p-layer. Trenches are formed in at least the semiconductor structure and separate the die into individually addressable segments. The active layer emits light or optical power having a first color point or spectrum. At least one wavelength converting layer is adjacent the die and converts the light or optical power to light or optical power having at least one second color point or spectrum and limits an energy ratio of the pump light or optical power that passes through the at least one wavelength converting layer unconverted to total light or optical power emitted by the light or optical power emitting device to less than 10%.

Abstract: An image capturing system (300), a kit for an image capturing system, a mobile phone, a use of an image capturing system and a method of configured a color matched light source are provided. The image capturing system obtains captured images having a substantially equal color reproduction in a portion illuminated by ambient light (L1) and a portion illuminated by a color matched light source (305). The image capturing system comprises an image capturing sensor (310), a controller (340) and the color matched light source. The color matched light source (305) comprises a first light source (320) and a second light source (330. The light emission spectra of the first and second light source are selected such that, in a color space of the image capturing sensor, a line between their color points is for a large part close to the locus line, while the first or second light source are at a distance from the locus line.

Abstract: The invention relates to a LED-based optical unit including a LED disposed on a surface and a monolithic module encompassing the LED and including a re-directing portion and a first diffusing portion. The first diffusing portion is configured to diffuse light incident thereon. The re-directing portion is configured to re-direct at least a first portion of light emitted by the LED to be incident on the first diffusing portion.

Abstract: The invention relates to a LED-based optical unit including a LED disposed on a surface and a monolithic module encompassing the LED and including a re-directing portion and a first diffusing portion. The first diffusing portion is configured to diffuse light incident thereon. The re-directing portion is configured to re-direct at least a first portion of light emitted by the LED to be incident on the first diffusing portion.

Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: A method of manufacturing a collection of variable focus lenses comprising two electrodes (21, 22) and a fluid chamber filled with two fluids which are separated by a meniscus, wherein the shape of the meniscus is variable under the influence of a voltage, comprises the following steps: providing an electrically insulating body (60) having a plurality of through-holes (14, 65); applying electrically conducting material to a surface of the body (60) in order to obtain the electrodes (21, 22); covering at least one of the obtained electrodes (21, 22) by a layer of electrically insulating material; covering an inner surface of a part of the through-holes (14) with a hydrophobic material; partially sealing these through-holes (14); arranging the fluids inside the partially sealed through-holes (14); completely sealing the through-holes (14); and dividing the body (60) into portions, such that each portion constitutes a complete lens.

Abstract: The present invention relates to a camera arrangement as for instance used in a mobile phone that utilizes a liquid crystal based lens for providing an adjustable depth of focus. The camera arrangement comprises a photo sensor (201) array and at least two lenses (202, 203, 204) that are arranged in a fixed and unitary arrangement. At least one of the lenses (202) comprises a liquid crystal layer (101) that provides for adjustable focal length in that lens. The additional lens(-es) (203, 204) might have fixed or adjustable focal length depending on the application. According to one embodiment, the camera arrangement comprises at least one additional adjustable lens ant the lenses are arranged so as to provide for adjustable depth? of focus as well as for an adjustable depth of field.

Abstract: In a method of correcting defects in image data comprising an array of pixels, the intensity of pixels of the image data in each side of the defect is sampled (5), differences between the samples intensities are calculated (6) to generate intensity difference signals (D1-D4) indicative of intensity differences across and on respective sides of the defect, and the defect is corrected (7-11) in dependence on the intensity difference signals (D1-D4). Preferably, depending on the intensity difference signals (D1-D4) either an average correction technique or no defect pixel correction is used, the average correction technique being used if the intensity difference signals do not exceed a predetermined level value (L1,L2).