Patents by Inventor Arjun Wadhwa

Arjun Wadhwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170226362
    Abstract: Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.
    Type: Application
    Filed: February 9, 2017
    Publication date: August 10, 2017
    Applicant: QI2 Elements, LLC
    Inventors: Vincent Fratello, Giovanni Nino, Arjun Wadhwa