Patents by Inventor Arlene Layson

Arlene Layson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound
    Publication number: 20060097366
    Abstract: A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
    Type: Application
    Filed: December 2, 2005
    Publication date: May 11, 2006
    Applicant: NS Electronics Bangkok (1993) Ltd.
    Inventors: Saravuth Sirinorakul, Arlene Layson, Somchai Nondhasitthichai, Yee Chua