Patents by Inventor Armin Studt

Armin Studt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8470131
    Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: June 25, 2013
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventor: Armin Studt
  • Publication number: 20120211172
    Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.
    Type: Application
    Filed: February 17, 2012
    Publication date: August 23, 2012
    Applicant: Semikron Elektronik GmbH & Ko. KG
    Inventor: Armin STUDT
  • Patent number: 6232555
    Abstract: A crimp connection between a flexible flat contact part (1) and a crimping ferrule (2) enclosing this contact part (1), wherein the crimp connection is characterized in that the crimping ferrule (2) has a base (3) and two side plates (4a, 4b) adjoining the base on opposite sides. The base (3) has at least one groove (6) towards the interior of the ferrule and transversely to the longitudinal ferrule axis (5), and ribs (7) arranged at the free ends of the side plates (4a, 4b). The ribs at the free end are disposed in such a way that, after crimping has taken place and with the side plates (4a, 4b) rolled in towards the interior of the ferrule, the said ribs press the flexible contact part (1) into the corresponding groove (6) and engage with the said part essentially positively into the corresponding groove (6).
    Type: Grant
    Filed: March 10, 1999
    Date of Patent: May 15, 2001
    Assignee: Framatome Connectors International
    Inventors: Martin Besler, Harald Lutsch, Armin Studt