Abstract: A semiconductor memory and a method for operating the latter in order are provided, at least in testwise fashion, to deactivate a word line segment (12) of a segmented word line not via a first line (21) otherwise used for deactivation, but rather via a second line (22) via that the word line segment (12) is otherwise activated. The second line (22) can optionally be biased with a second potential (Vpp) provided for activation or with a third potential (Vgnd). If the third potential (Vgnd) is used for at least temporarily deactivating the word line segment (12), the word line segment can be driven via a switching element (17), which couples the word line segment to the second line (22), without the complementary switching element (16) of the driver segment (20) having to be used for deactivation.

Abstract: An integrated semiconductor memory including memory cells which can be driven via first and second word lines and can be replaced by redundant memory cells. In the first memory cell type, data can be stored corresponding to the data present at a data input terminal. In the memory cells of a second memory cell type, data can be stored inverted with respect to data present at the data input terminal. The integrated semiconductor memory includes a circuit for data inversion, wherein the data are written to a redundant memory cell, inverted with respect to the data present at the data input terminal if the defective memory cell and the redundant memory cell replacing it are situated in different word line strips of a bit line twist, and if the defective memory cell and the redundant memory cell replacing it are associated with different memory cell types.

Abstract: An integrated dynamic random access memory chip is provided, the memory chip comprising a plurality of volatile memory cells for storing user data and a plurality of non-volatile rewritable memory cells for storing at least one of repair data, trimming data, sorting data and identification data.

Abstract: A method for repairing an integrated memory having first units of memory cells and second, redundant units of memory cells for replacing first units of memory cells. The first units of memory cells are tested with regard to their functionality. In the case of a defect ascertained in one of the first units, a number of redundant units is programmed as an associated cluster for replacing one or more of the first units. In this way, a repair element is formed with a cluster size corresponding to the number of redundant units. The cluster size of respective repair elements is set in a variable manner by a redundancy circuit. As a result, in a test and repair operation, a comparatively short test time of the memory is made possible in conjunction with a yield that remains good.

Abstract: A semiconductor memory and a method for operating the latter in order are provided, at least in testwise fashion, to deactivate a word line segment (12) of a segmented word line not via a first line (21) otherwise used for deactivation, but rather via a second line (22) via that the word line segment (12) is otherwise activated. The second line (22) can optionally be biased with a second potential (Vpp) provided for activation or with a third potential (Vgnd). If the third potential (Vgnd) is used for at least temporarily deactivating the word line segment (12), the word line segment can be driven via a switching element (17), which couples the word line segment to the second line (22), without the complementary switching element (16) of the driver segment (20) having to be used for deactivation.

Abstract: The object of designing a magneto resistive memory such that it is as resistant as possible to magnetic stray fields, offers a longest possible retention time of the information stored, and ensures a good read signal, which is achieved by the MRAM memory cells comprising a first ferromagnetic layer or reference layer, a second ferromagnetic layer or reference layer adapted to be magnetized by an external magnetic field, and a non-magnetic or non-magnetizable intermediate layer positioned between the first and second ferromagnetic layers, wherein a ferrimagnetic assistant layer is at least partially adjacently positioned at the ferromagnetic memory layer of the MRAM memory cells, and is adapted to be mechanically coupled therewith. The present invention offers higher stability and longer retention of the information stored, and thus an improvement of the read out signal.

Abstract: A semiconductor product includes a first semiconductor circuit and at least one further integrated semiconductor circuit arranged together on a semiconductor substrate. The first semiconductor circuit and the at least one further semiconductor circuit are separated from one another by a frame region and each including contact connections. Interconnects cross the frame region and short-circuit a contact connection of the first semiconductor circuit with a contact connection of the at least one further semiconductor circuit.

Abstract: An integrated semiconductor memory including memory cells which can be driven via first and second word lines and can be replaced by redundant memory cells. In the first memory cell type, data can be stored corresponding to the data present at a data input terminal. In the memory cells of a second memory cell type, data can be stored inverted with respect to data present at the data input terminal. The integrated semiconductor memory includes a circuit for data inversion, wherein the data are written to a redundant memory cell, inverted with respect to the data present at the data input terminal if the defective memory cell and the redundant memory cell replacing it are situated in different word line strips of a bit line twist, and if the defective memory cell and the redundant memory cell replacing it are associated with different memory cell types.

Abstract: An electronic circuit in an integrated circuit having memory cells is described. The circuit permits information to be written to particular memory cells only once, so that subsequent writing to the particular memory cells is blocked. The circuit is used in a test structure for integrated circuits on a wafer. A method for testing integrated circuits on a wafer that are connected to a test apparatus is also described. Once the supply voltage to a first circuit to be tested has been turned on, a preliminary test is carried out to ascertain parameters that need to be set. The supply voltage is then applied to a next circuit to be tested, a preliminary test is carried out, and memory cells have information written to them, until the parameters have been set for all the connected circuits to be tested. The test apparatus then carries out the actual operational test in parallel for all the connected circuits to be tested.

Abstract: A method for repairing an integrated memory having first units of memory cells and second, redundant units of memory cells for replacing first units of memory cells. The first units of memory cells are tested with regard to their functionality. In the case of a defect ascertained in one of the first units, a number of redundant units is programmed as an associated cluster for replacing one or more of the first units. In this way, a repair element is formed with a cluster size corresponding to the number of redundant units. The cluster size of respective repair elements is set in a variable manner by a redundancy circuit. As a result, in a test and repair operation, a comparatively short test time of the memory is made possible in conjunction with a yield that remains good.

Abstract: An integrated memory circuit includes a memory cell addressed through a first word line and read through a first bit line. The first word line is connected to a word line control circuit for activating, based upon an address, a first word line associated with the memory cell to be read. A data item stored in the addressable memory cell is read through the first bit line using a read apparatus, in particular, a sense amplifier. A second word line is provided to connect a capacitance element to a second bit line, the second bit line being adjacent to the first bit line. The word line control circuit is adapted to connect the capacitance element to the second bit line using the second word line substantially simultaneously with activation of the first word line. A method for reading the data item is also provided.

Abstract: An electronic circuit in an integrated circuit having memory cells is described. The circuit permits information to be written to particular memory cells only once, so that subsequent writing to the particular memory cells is blocked. The circuit is used in a test structure for integrated circuits on a wafer. A method for testing integrated circuits on a wafer that are connected to a test apparatus is also described. Once the supply voltage to a first circuit to be tested has been turned on, a preliminary test is carried out to ascertain parameters that need to be set. The supply voltage is then applied to a next circuit to be tested, a preliminary test is carried out, and memory cells have information written to them, until the parameters have been set for all the connected circuits to be tested. The test apparatus then carries out the actual operational test in parallel for all the connected circuits to be tested.