Patents by Inventor Arne Fleißner
Arne Fleißner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12048191Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.Type: GrantFiled: August 10, 2023Date of Patent: July 23, 2024Assignee: Pictiva Displays International LimitedInventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Publication number: 20230389353Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.Type: ApplicationFiled: August 10, 2023Publication date: November 30, 2023Applicant: Pictiva Displays International LimitedInventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Patent number: 11765932Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.Type: GrantFiled: January 13, 2021Date of Patent: September 19, 2023Assignee: Pictiva Displays International LimitedInventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Patent number: 11569479Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.Type: GrantFiled: June 1, 2021Date of Patent: January 31, 2023Assignee: OSRAM OLED GmbHInventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
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Publication number: 20220223823Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.Type: ApplicationFiled: April 1, 2022Publication date: July 14, 2022Applicant: Pictiva Displays International LimitedInventor: Arne Fleissner
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Patent number: 11322717Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.Type: GrantFiled: May 24, 2017Date of Patent: May 3, 2022Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITEDInventor: Arne Fleissner
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Patent number: 11201310Abstract: An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.Type: GrantFiled: September 16, 2015Date of Patent: December 14, 2021Assignee: Pictiva Displays International LimitedInventors: Philipp Schwamb, Erwin Lang, Arne Fleissner
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Publication number: 20210359268Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.Type: ApplicationFiled: June 1, 2021Publication date: November 18, 2021Applicant: OSRAM OLED GmbHInventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
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Patent number: 11056660Abstract: The invention relates to an organic optoelectronic component (10) comprising a first electrode layer (2), having a doped matrix material and metal nanowires, an organic active layer (3), which is suitable for emitting or detecting electromagnetic radiation, and a second electrode layer (6). The organic active layer (3) is directly adjacent to the first electrode layer (2). The invention further relates to a method for producing the organic optoelectronic component (10).Type: GrantFiled: May 20, 2015Date of Patent: July 6, 2021Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITEDInventors: Silke Scharner, Daniel Riedel, Arne Fleissner, Thomas Wehlus, Nina Riegel, Johannes Rosenberger
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Patent number: 11043654Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.Type: GrantFiled: March 25, 2020Date of Patent: June 22, 2021Assignee: OSRAM OLED GmbhInventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
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Publication number: 20210184175Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.Type: ApplicationFiled: January 13, 2021Publication date: June 17, 2021Applicant: Pictiva Displays International LimitedInventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Publication number: 20210151708Abstract: A component module is disclosed that includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side. In some implementations, the radiation emitting component includes a substrate. In some implementations, a neutral fiber runs outside the substrate.Type: ApplicationFiled: January 27, 2021Publication date: May 20, 2021Applicant: OSRAM OLED GmbHInventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
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Patent number: 10944081Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.Type: GrantFiled: March 10, 2020Date of Patent: March 9, 2021Assignee: OSRAM OLED GmbHInventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
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Patent number: 10930890Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.Type: GrantFiled: August 18, 2020Date of Patent: February 23, 2021Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITEDInventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Publication number: 20200381666Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Patent number: 10804497Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit a radiation during operation of the component, and a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, and a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places.Type: GrantFiled: March 20, 2017Date of Patent: October 13, 2020Assignee: OSRAM OLED GmbHInventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
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Publication number: 20200266370Abstract: In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.Type: ApplicationFiled: May 7, 2020Publication date: August 20, 2020Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
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Publication number: 20200227683Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.Type: ApplicationFiled: March 25, 2020Publication date: July 16, 2020Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
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Publication number: 20200212343Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.Type: ApplicationFiled: March 10, 2020Publication date: July 2, 2020Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
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Patent number: 10693088Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.Type: GrantFiled: October 18, 2017Date of Patent: June 23, 2020Assignee: OSRAM OLED GMBHInventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel