Abstract: A sleeve (22) enables attachment of an optic fiber (14) to a multi-integrated optic chip (10) in optical communication therewith, and maintains alignment of the fiber at its end adjacent the chip. The sleeve includes a symmetrically-shaped cavity (26) bounded by termini (30, 32) which are respectively disposed to fit onto the chip and to accept the fiber. An adhesive (46) within the cavity symmetrically bonds the fiber to the chip. The adhesive cures symmetrically in the cavity, to eliminate undesired motion of the fiber from its preferred alignment position vis-a-vis the chip connection point (12) or to provide a repeatable motion to achieve the optimum alignment position of the fiber with respect to the chip. The sleeve may be left in place or, alternatively, it may be removed. The sleeve controls, defines and confines the index matching adhesive and/or fluid between fiber end (44) and connection point (12) by defining the areas and volume actually in contact with the adhesive or fluid.

Abstract: A sleeve (22) enables attachment of an optic fiber (14) to a multi-integrated optic chip (10) in optical communication therewith, and maintains alignment of the fiber at its end adjacent the chip. The sleeve includes a symmetrically-shaped cavity (26) bounded by termini (30, 32) which are respectively disposed to fit onto the chip and to accept the fiber. An adhesive (46) within the cavity symmetrically bonds the fiber to the chip. The adhesive cures symmetrically in the cavity, to eliminate undesired motion of the fiber from its preferred alignment position vis-a-vis the chip connection point (12) or to provide a repeatable motion to achieve the optimum alignment position of the fiber with respect to the chip. The sleeve may be left in place or, alternatively, it may be removed. The sleeve controls, defines and confines the index matching adhesive and/or fluid between fiber end (44) and connection point (12) by defining the areas and volume actually in contact with the adhesive or fluid.

Abstract: A precision, micro-mechanical semiconductor accelerometer of the differential-capacitor type comprises a pair of etched opposing cover layers fusion bonded to opposite sides of an etched proofmass layer to form a hermetically sealed assembly. The cover layers are formed from commercially available, Silicon-On-Insulator (“SOI”) wafers to significantly reduce cost and complexity of fabrication and assembly. The functional semiconductor parts of the accelerometer are dry-etched using the BOSCH method of reactive ion etching (“RIE”), thereby significantly reducing contamination inherent in prior art wet-etching processes, and resulting in features advantageously bounded by substantially vertical sidewalls.

Abstract: The fiber jacket application system is used to provide a protective jacket over spliced optical fibers (10, 12), such as to coat a length of bare fiber, previously coated fiber, and particularly to rejacket a length of fiber in which the jacket was removed for splicing. Curable jacketing material is twice fed from a reservoir (28) through a small orifice or syringe (32) onto the respective sides of bared portions (10d, 12d) of the fiber. A first material (14) is deposited from and between the existing jackets (10a, 12a) and onto essentially half of the bared portions. A second material (16) is deposited in bonded contact with the first applied material from and between the surrounding protective jackets and onto essentially the remaining half of the bared portions.

Abstract: An improved laser diode is taught. A laser diode chip with an optical port for outputing an optical signal is mounted on a substrate. The substrate has a perimeter that extends beyond the area of the laser diode chip. The lens face of an optical fiber is aligned to receive the optical signal from the optical port. The optical fiber is secured at a pad location on the substrate with a solder ball. A portion of the substrate is mounted on a TEC leaving an overhang portion unsupported by the TEC. The overhang portion of the substrate forms a ledge portion of the substrate. A thermal insulating slot and a stress relief slot are micromachined through the substrate forming an "L" shaped slot defining a cantilever fiber support segment of the substrate. The fiber is mounted on the end of the fiber support segment with a solder ball.

Abstract: A precision, micro-mechanical semiconductor accelerometer of the differential-capacitor type comprises a pair of etched opposing cover layers fusion bonded to opposite sides of an etched proofmass layer to form a hermetically sealed assembly. The cover layers are formed from commercially available, Silicon-On-Insulator ("SOI") wafers to significantly reduce cost and complexity of fabrication and assembly. The functional semiconductor parts of the accelerometer are dry-etched using the BOSCH method of reactive ion etching ("RIE"), thereby significantly reducing contamination inherent in prior art wet-etching processes, and resulting in features advantageously bounded by substantially vertical sidewalls.

Abstract: The invention relates to alkaline resistant glasses, particularly glass fibers, which comprise silica, calcia and at least one lanthanide series metal oxide effective to enhance the alkali resistance of the glasses.