Abstract: In certain embodiments, a video camera system includes a camera housing including a back side, a plurality of concentric electrical traces disposed on the back side of the camera housing, and a notched mounting apparatus disposed on the back side of the camera housing, where the notched mounting apparatus can be operable to receive and secure a modular attachment to the camera housing such that the modular attachment is mechanically and rotatably coupled to the camera housing. In some implementations, the one or more of the concentric electrical traces can be configured to contact one or more electrical contacts of the modular attachment and remain in contact with the one or more electrical contacts as the camera housing is rotated with respect to the modular attachment.

Abstract: In certain embodiments, a video camera system includes a modular attachment to couple to a video camera housing, the modular attachment including a slot extending into the modular attachment and a base support including a ball-and-socket joint providing a range of motion for the base support and a tongue fixed to the ball-and-socket joint and extending therefrom, where the slot is configured to receive the tongue such that the modular attachment couples and secures to the base support according to a first friction, and where an orientation of the battery pack with respect to the base support is adjustable according to the range of motion of the ball-and-socket joint according to a second friction. The second friction can be greater than the first friction such that coupling or decoupling the battery pack from the base support does not cause the ball-and-socket joint to rotate.

Abstract: Certain embodiments of the invention include a modular video camera system that can be adapted to mount to a number of different surfaces and perform a number of different functions. Some embodiments include a video camera housing having a front portion with a camera lens and infra-red (IR) emitter disposed thereon, a mounting apparatus to couple to and secure the camera system to a window pane such that the front portion of the housing faces the window pane, and a silicone-based compound, placed between the IR emitter and the window pane, that is translucent to IR light and prevents IR light from reflecting off of the window pane and into the camera lens. Some embodiments include a video camera system with a battery pack coupled to a base support having an orientation adjustment apparatus to prevent inadvertent adjustments to an orientation of the video camera system.

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: Disclosed is a piezo-electrically actuated micro-mechanical deformable member comprising a corrugated longitudinal beam (521) formed in a substrate, and having a first anchored end (502) and a second end (509), as well as a plurality of piezoelectric film (PZET) actuating segments (522, 523, 524) formed in or on at least some grooves and ridges of the corrugated beam, the beam (521) being configured to assume one of a number of different geometric configurations depending upon which of a corresponding set of electric actuation signals (105) are applied to the PZET elements, the electric actuation signals establishing corresponding electric fields in the associated PZET segments to thereby deform the member.

Abstract: Disclosed is a piezo-electrically actuated micro-mechanical deformable member comprising a corrugated longitudinal beam (521) formed in a substrate, and having a first anchored end (502) and a second end (509), as well as a plurality of piezoelectric film (PZET) actuating segments (522, 523, 524) formed in or on at least some grooves and ridges of the corrugated beam, the beam (521) being configured to assume one of a number of different geometric configurations depending upon which of a corresponding set of electric actuation signals (105) are applied to the PZET elements, the electric actuation signals establishing corresponding electric fields in the associated PZET segments to thereby deform the member.

Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.