Patents by Inventor Art Bayot

Art Bayot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
    Patent number: 7100813
    Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: September 5, 2006
    Assignee: Texas Instruments Incorporated
    Inventor: Art Bayot
  • METHOD OF MITIGATING VOIDS DURING SOLDER REFLOW
    Publication number: 20060091184
    Abstract: A Solder bump is formed by providing solder material on a conductive site of a substrate. The solder material is reflowed to provide a solder bump on the substrate. The solder material is ultrasonically agitated during at least a part of the reflow to at least partially mitigate formation of voids in the solder bump.
    Type: Application
    Filed: October 28, 2004
    Publication date: May 4, 2006
    Inventors: Art Bayot, Richard Valerio
  • System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
    Publication number: 20040149804
    Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.
    Type: Application
    Filed: January 20, 2004
    Publication date: August 5, 2004
    Inventor: Art Bayot
  • System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
    Patent number: 6703259
    Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: March 9, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Art Bayot
  • System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
    Publication number: 20030124765
    Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.
    Type: Application
    Filed: September 12, 2002
    Publication date: July 3, 2003
    Inventor: Art Bayot