Abstract: Systems and methods for recognizing motion made by a moving person are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the moving person with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: A method of reducing variation in optical power levels across a group of light emitting diodes includes testing each respective one of the light emitting diodes to determine an optical power level produced by that light emitting diode when connected to an electrical power source. During testing, the electrical power source delivers a substantially identical amount of electrical current to each respective one of the light emitting diodes. The optical power levels from the test all fall within a first range of values. The method includes connecting an electrical resistance in parallel with at least some of the light emitting diodes to reduce an amount of optical power produced by those light emitting diodes. After the electrical resistances are connected, all of the optical power levels produced by the light emitting diodes fall within a second range that is narrower than the first range.

Abstract: Systems and methods for recognizing a gesture made by a warm object are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the warm object with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: Systems and methods for recognizing motion made by a moving person are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the moving person with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: Systems and methods for recognizing a gesture made by a warm object are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the warm object with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: A method of reducing variation in optical power levels across a group of light emitting diodes includes testing each respective one of the light emitting diodes to determine an optical power level produced by that light emitting diode when connected to an electrical power source. During testing, the electrical power source delivers a substantially identical amount of electrical current to each respective one of the light emitting diodes. The optical power levels from the test all fall within a first range of values. The method includes connecting an electrical resistance in parallel with at least some of the light emitting diodes to reduce an amount of optical power produced by those light emitting diodes. After the electrical resistances are connected, all of the optical power levels produced by the light emitting diodes fall within a second range that is narrower than the first range.

Abstract: A vertically stacked thermopile and an IR sensor using said stacked thermopiles are provided. The vertically stacked thermopile may include multiple thermocouples stacked vertically on one another. The thermocouples may be connected in series, parallel, or a combination of series and parallel. One or more vertically stacked thermopiles may be included in an IR sensor and the thermopiles may be connected in series, parallel, or a combination of series and parallel.

Abstract: A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages.

Abstract: A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages.

Abstract: A heater (15) for a sensor (10) comprises a substrate (20), an electrically conductive heating structure (21) on the substrate (20), and one or more connecting portions (28) for electrically connecting the heating structure (21) to one or more outside terminals (14) of the sensor (10). The substrate (20) is rigid and can comprise ceramics, preferably alumina ceramics.

Abstract: A radiation sensor (10) comprises plural radiation sensing elements (1) arranged along an arrangement line, a lens having an optical axis focusing radiation towards the sensing elements, and circuitry (2) receiving the electric signal of the sensing elements and providing an output signal. The midpoint of the arrangement line may be offset against the optical axis of the converging section (5). At least some of the sensing elements may have different sizes. At least some of the sensing elements may have different relative sensitivity compared to each other. Two or more pairs of adjacent sensing elements may have a different pitch.

Abstract: A surface mountable radiation guide for a radiation path between a measurement volume (1) and an electro-optical component has a first radiation interface in a radiation path towards the measurement volume, a third radiation interface in a radiation path towards the electro-optical component, and a reflecting portion forming a first radiation path between the first and the third radiation interface, said first radiation path providing a focus region at the measurement volume.

Abstract: A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages.

Abstract: A flashlamp cartridge (10) comprises an cartridge portion for a flashlamp (1), cooling device components for a cooling device (11, 12) for the flashlamp, one or more thermal cartridge terminals (13) for the cooling device for thermally connecting the flashlamp cartridge to a socket, and one or more electrical cartridge terminals (14) for the flashlamp for electrically connecting the flashlamp cartridge to a socket. A flashlamp assembly comprises such flashlamp cartridge (10) and a flashlamp (1) accommodated in the flashlamp cartridge. A socket for a flashlamp assembly comprises corresponding electric socket terminals (24) and thermal socket terminals (23). An electrical device comprises such socket.

Abstract: A vertically stacked thermopile and an IR sensor using said stacked thermopiles are provided. The vertically stacked thermopile may include multiple thermocouples stacked vertically on one another. The thermocouples may be connected in series, parallel, or a combination of series and parallel. One or more vertically stacked thermopiles may be included in an IR sensor and the thermopiles may be connected in series, parallel, or a combination of series and parallel.

Abstract: A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages.

Abstract: A surface mountable radiation guide for a radiation path between a measurement volume (1) and an electro-optical component has a first radiation interface in a radiation path towards the measurement volume, a third radiation interface in a radiation path towards the electro-optical component, and a reflecting portion forming a first radiation path between the first and the third radiation interface, said first radiation path providing a focus region at the measurement volume.

Abstract: A flashlamp cartridge (10) comprises an cartridge portion for a flashlamp (1), cooling device components for a cooling device (11, 12) for the flashlamp, one or more thermal cartridge terminals (13) for the cooling device for thermally connecting the flashlamp cartridge to a socket, and one or more electrical cartridge terminals (14) for the flashlamp for electrically connecting the flashlamp cartridge to a socket. A flashlamp assembly comprises such flashlamp cartridge (10) and a flashlamp (1) accommodated in the flashlamp cartridge. A socket for a flashlamp assembly comprises corresponding electric socket terminals (24) and thermal socket terminals (23). An electrical device comprises such socket.