Abstract: A Virtual Design Module (VDM) used in a networked design environment generates manufactured product designs that are near optimal in terms of cost and production cycle time by using design data files containing alternative parts and manufacturers information. Numerous product design alternatives are considered and evaluated in terms of design-manufacturing-parts-supplier feasibility and real-time information on cost and production cycle time for realization. The VDM generates a population of new designs with appropriate board design information to allow for design-manufacturer-supplier decision making and determines the feasibility of each member of the current generation of designs and rejects designs that are not feasible. The VDM triggers Mobile Software Agents (MSA) that obtain data for parts availability, cost, lead time and manufacturer data for manufacturing availability, cost and lead time for each feasible member of the current generation of designs and return the data.

Abstract: A micromechanical gyroscopic sensor array for detecting rotational movement includes a plurality of vibrational microgyroscopic sensing elements fixedly oriented in a common plane relative to one another such that an in-plane direction and an out-of-plane direction orthogonal thereto are defined. A mechanism for driving each microgyroscopic sensing element at a predetermined in-plane drive frequency is provided. Each sensing element has a predefined out-of-plane resonant frequency selected such that a range of in-plane frequencies and/or out-of-plane resonant frequency differences exist among the sensing elements. A resonant gate transistor is associated with each sensing element for sensing out-of-plane motion and producing a sense signal representative thereof. Signal processing then converts the sense signal to a signal representative of rotational movement experienced by the micromechanical gyroscopic sensor array.

Abstract: The invention is an automated solder joint inspection system for determining the quality of a specular soldered joint through examination of the shape of the joint surface using a series of point light sources and the associated highlight reflections from the joint surface. The light from point light sources, which is directed toward the solder joint, is reflected in a pattern from the solder joint to an array of light responsive transducers from at least one location. Utilizing the intensity values from the light responsive transducer array, the surface orientation of the solder joint at a number of points is determined. The solder joint is evaluated in one of two ways. In one way, using known surface features of solder joints along with curve fitting techniques, a series of grid maps is mathematically interpreted to reconstruct the solder joint surface.

Abstract: The invention is an automated solder joint inspection system for determining the quality of a specular soldered joint through examination of the shape of the joint surface using a series of point light sources and the associated highlight reflections from the joint surface. The light from the point light sources, which is directed toward the solder joint, is reflected in a pattern from the solder joint to an array of light responsive transducers, such as a camera, at a fixed location. Utilizing the intensity values from the light responsive transducer array, a binary grid map is generated for the reflections from each point light source. Using known surface features of solder joints along with curve fitting techniques, a series of grid maps may be mathematically interpreted to reconstruct the solder joint surface. A rule-based system, through comparison with acceptable solder joint surface features, evaluates and classifies the joint for an acceptability determination.

Abstract: The invention is a multi-channel position detection system which utilizes several separate emitters and a single photodetector to, for example, align a multi-lead component manipulator with a predetermined location in a printed circuit board. An oscillator circuit generates a modulated signal for each emitter and a multiplier circuit develops an output signal based upon the oscillator output and the photodetector output. The photodetector provides an output responsive to the emitter signal as attenuated by the circuit board location relative to the emitter. When the lead hole of the circuit board is aligned with the emitter and photodetector minimum attenuation of the signal occurs.

Abstract: A multi-lead component manipulator for the assembly of circuit boards has optical and tactile feedback systems and includes at least two and preferably three symmetric assemblies radially disposed about a component gripper assembly. Each symmetric assembly has a movable lead guide means for engaging a component lead and aligning the same for circuit board insertion. The guide means are adapted for independent arcuate and radial motion reflective of the optical feedback system and the gripper assembly is capable of axial movement for the acquisition and insertion of components. The tactile feedback system controls component insertion. The manipulator in an alternative embodiment has fixed guide means disposed above the movable guide means. The fixed guide means orient the component leads for acquisition by the movable guide means.