Patents by Inventor Arthur Fong-Yuen Pun
Arthur Fong-Yuen Pun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105692Abstract: RF transistor amplifier circuits are provided that comprise a circuit board and an RF transistor amplifier die. The RF transistor amplifier die is flip-chip mounted on an upper surface of the circuit board so that a gate terminal, a drain terminal and a source terminal of the die face the upper surface of the circuit board. These RF transistor amplifier circuits further include a heatsink mounted on an upper surface of the RF transistor amplifier die and a plurality of surface mount circuit elements mounted on the upper surface of the circuit board so that a footprint of the heatsink vertically overlaps each of the plurality of surface mount circuit elements.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Woo Eng Wah, Liew Soon Lee, Alexander Komposch, Arthur Fong-Yuen Pun, Jeremy Fisher
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Patent number: 11769757Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: GrantFiled: October 15, 2019Date of Patent: September 26, 2023Assignee: CreeLED, Inc.Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Publication number: 20230253359Abstract: A semiconductor die includes a silicon carbide (SiC) substrate and a metal stack. The SiC substrate has a first surface including a semiconductor layer thereon and a second surface that is opposite the first surface. The metal stack has an upper surface that attaches to the second surface of the SiC substrate and a lower surface that is opposite the upper surface. The metal stack includes a eutectic solder layer and a noble metal layer on the eutectic solder layer. The noble metal layer comprises a final metal layer on the lower surface.Type: ApplicationFiled: February 4, 2022Publication date: August 10, 2023Inventors: Alexander Komposch, Arthur Fong-Yuen Pun, Scott T. Sheppard, Kevin Shawne Schneider
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Patent number: 10950769Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.Type: GrantFiled: February 14, 2017Date of Patent: March 16, 2021Assignee: Cree, Inc.Inventors: Michael John Bergmann, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer
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Publication number: 20200043905Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: ApplicationFiled: October 15, 2019Publication date: February 6, 2020Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Patent number: 10453825Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: GrantFiled: November 11, 2014Date of Patent: October 22, 2019Assignee: Cree, Inc.Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Patent number: 10439114Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.Type: GrantFiled: March 8, 2017Date of Patent: October 8, 2019Assignee: Cree, Inc.Inventors: Erin R. F. Welch, Colin Kelly Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun
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Publication number: 20180261741Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.Type: ApplicationFiled: March 8, 2017Publication date: September 13, 2018Inventors: Erin R. F. Welch, Colin Kelly Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun
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Patent number: 10074635Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.Type: GrantFiled: July 17, 2015Date of Patent: September 11, 2018Assignee: Cree, Inc.Inventors: Nishant Tiwari, Colin Kelly Blakely, Jesse Colin Reiherzer, Mark Edmond, Arthur Fong-Yuen Pun, Michael Bergmann
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Publication number: 20170155026Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.Type: ApplicationFiled: February 14, 2017Publication date: June 1, 2017Inventors: Michael John BERGMANN, Colin Kelly BLAKELY, Arthur Fong-Yuen PUN, Jesse Colin REIHERZER
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Patent number: 9601673Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.Type: GrantFiled: November 21, 2014Date of Patent: March 21, 2017Assignee: Cree, Inc.Inventors: Michael John Bergmann, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer
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Publication number: 20170018538Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.Type: ApplicationFiled: July 17, 2015Publication date: January 19, 2017Inventors: Nishant Tiwari, Colin Kelly Blakely, Jesse Colin Reiherzer, Mark Edmond, Arthur Fong-Yuen Pun, Michael Bergmann
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Patent number: 9437785Abstract: Light emitting diodes include a silicon carbide substrate having first and second opposing faces, a diode region on the first face, anode and cathode contacts on the diode region opposite the silicon carbide substrate and a hybrid reflector on the silicon carbide substrate opposite the diode region. The hybrid reflector includes a transparent layer having an index of refraction that is lower than the silicon carbide substrate, and a reflective layer on the transparent layer, opposite the substrate. A die attach layer may be provided on the hybrid reflector, opposite the silicon carbide substrate. A barrier layer may be provided between the hybrid reflector and the die attach layer.Type: GrantFiled: August 10, 2009Date of Patent: September 6, 2016Assignee: Cree, Inc.Inventors: Michael John Bergmann, Kevin Ward Haberern, Bradley E. Williams, Winston T. Parker, Arthur Fong-Yuen Pun, Doowon Suh, Matthew Donofrio
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Patent number: 9406594Abstract: Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.Type: GrantFiled: November 21, 2014Date of Patent: August 2, 2016Assignee: Cree, Inc.Inventors: Colin Kelly Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun
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Publication number: 20160149104Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.Type: ApplicationFiled: November 21, 2014Publication date: May 26, 2016Inventors: Michael John Bergmann, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer
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Publication number: 20160148860Abstract: Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.Type: ApplicationFiled: November 21, 2014Publication date: May 26, 2016Inventors: Colin Kelly Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun
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Publication number: 20160133610Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: ApplicationFiled: November 11, 2014Publication date: May 12, 2016Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Publication number: 20160079472Abstract: Semiconductor devices and related methods are disclosed. In one aspect, a semiconductor device includes a substrate and an active area disposed over the substrate. The active area includes at least one or more corner region having a non-orthogonal angled edge. A method of providing a semiconductor device is also provided. The method includes providing a substrate and fabricating an active area over the substrate. The active area includes at least one or more corner region with a non-orthogonal angled edge. LED chips and methods herein have a reduced sensitivity to corner cracking, fracturing, or chipping.Type: ApplicationFiled: September 15, 2014Publication date: March 17, 2016Inventors: Arthur Fong-Yuen Pun, David B. Slater, JR.
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Patent number: 8853712Abstract: A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 250 lumens per watt, and in some cases up to 270 lumens per watt.Type: GrantFiled: October 26, 2012Date of Patent: October 7, 2014Assignee: Cree, Inc.Inventors: Christopher P. Hussell, Florin Tudorica, David Todd Emerson, Michael John Bergmann, Arthur Fong-Yuen Pun
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Publication number: 20110031502Abstract: Light emitting diodes include a silicon carbide substrate having first and second opposing faces, a diode region on the first face, anode and cathode contacts on the diode region opposite the silicon carbide substrate and a hybrid reflector on the silicon carbide substrate opposite the diode region. The hybrid reflector includes a transparent layer having an index of refraction that is lower than the silicon carbide substrate, and a reflective layer on the transparent layer, opposite the substrate. A die attach layer may be provided on the hybrid reflector, opposite the silicon carbide substrate. A barrier layer may be provided between the hybrid reflector and the die attach layer.Type: ApplicationFiled: August 10, 2009Publication date: February 10, 2011Inventors: Michael John Bergmann, Kevin Ward Haberern, Bradley E. Williams, Winston T. Parker, Arthur Fong-Yuen Pun, Doowon Suh, Matthew Donofrio