Patents by Inventor Arthur Khoon Siah Ang

Arthur Khoon Siah Ang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for low temperature lamination of metals to polyimides
    Patent number: 6537411
    Abstract: The present invention is directed to a method for the lamination of metals, and especially copper, to the surface of polyimides and derivatives of polyimides at temperatures substantially below the curing temperature of the imide polymers. More specifically, the invention is directed to a method for surface modification of polyimides and derivatives of polyimides by thermal graft copolymerization and interfacial polymerization with concurrent lamination of the metal of interest in the presence of an appropriate functional monomer. The process can be carried out under atmospheric conditions and either in the presence or the complete absence of an added polymerization initiator. The so laminated polyimide-metal interfaces exhibit T-peel adhesion strengths in excess of 16 N/cm. The adhesion strength also exceeds the fracture strength of polyimide films with a thickness of 75 &mgr;m.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: March 25, 2003
    Assignees: The National University of Singapore, Institute of Microelectronics
    Inventors: En-Tang Kang, Arthur Khoon Siah Ang, Koon Gee Neoh, Cheng Qiang Cui, Thiam Beng Lim