Abstract: Semiconductor wafer clamp device includes at least one clamp apparatus, the clamp apparatus including a removable clamp finger coupled to a connecting block by a connector. The device allows access to clamp apparatus from a top surface of a substrate holder, eliminating the need to remove the substrate holder in order to perform maintenance or repair operations on clamp apparatus. Tempered springs in the clamp apparatus reduce resilience losses experienced with non-tempered springs. Plastic clamp shaft bushings and spring retainers extend the useful life of clamp apparatus components by eliminating wear caused by metal-to-metal contact of moving parts.