Patents by Inventor Arthur V. Sedrick, Jr.

Arthur V. Sedrick, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4771929
    Abstract: An improved solder reflow system for mass joining with solder electrical and electronic components affixed on a circuit board is provided. The system employs a combination of IR heating, recirculating forced hot air heating, and focused forced hot air heating to achieve solder reflow at throughput speeds and soldering quality not heretofore achievable.
    Type: Grant
    Filed: February 20, 1987
    Date of Patent: September 20, 1988
    Assignee: Hollis Automation, Inc.
    Inventors: Karl E. Bahr, Arthur V. Sedrick, Jr.