Patents by Inventor Artur Weitze

Artur Weitze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thick film varistor and method of producing same
    Patent number: 4186367
    Abstract: A glass-free thick film varistor operable at operating voltages ranging from about 30 to 200 volts per mm of active varistor material is produced by providing a screen-printable paste comprised of a non-glass containing substantially homogeneous mixture of granular varistor materials which have ZnO as the main component thereof and an organic binder, applying such paste in a desired pattern onto an insulating substrate and sintering such applied paste at relatively high temperatures so as to convert the paste into thick film varistors.
    Type: Grant
    Filed: June 22, 1978
    Date of Patent: January 29, 1980
    Assignee: Siemens Aktiengesellschaft
    Inventors: Naresh Chakrabarty, Richard Einzinger, Artur Weitze
  • Producing thick film circuits having terminal elements
    Patent number: 4084314
    Abstract: A process for producing a thick film circuit with terminal elements on an inorganic substrate. A paste of silver powder, copper oxide powder and organic bonding agent is silk screen printed on an inorganic substrate, dried and sintered. Then over preselected locations along individual conductor paths terminal elements are hard soldered. The conductor paths are strongly adhered to the inorganic substrate and the terminal elements are likewise strongly adhered to the individual conductor paths.
    Type: Grant
    Filed: February 22, 1977
    Date of Patent: April 18, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Naresh Chakrabarty, Artur Weitze
  • Process for the production of a multi-chip wiring arrangement
    Patent number: 4047290
    Abstract: A process for producing multi-chip wiring arrangements which consist of a ceramic carrier with through contact holes associated with thin film wiring on one side of the carrier and with multi layer, thick layer wiring on the other side of the carrier. The holes on the one side of the carrier are metallized and galvanically strengthened while the holes on the other side of the carrier are sealed by baking therein a thick layer of paste. Thereafter the multi layer, thick layer wiring and the thin film wiring are produced in that order.
    Type: Grant
    Filed: September 2, 1975
    Date of Patent: September 13, 1977
    Assignee: Siemens Aktiengesellschaft
    Inventors: Artur Weitze, Michail Sapunarow
  • Thick-layer conductor path pastes
    Patent number: 4039721
    Abstract: A thick-layer conductor path paste consisting of a suspension of a powder mixture containing metals and fritted glass in an organic carrier medium. Also, methods for making conductor paths and the paths so made.
    Type: Grant
    Filed: September 9, 1975
    Date of Patent: August 2, 1977
    Assignee: Siemens Aktiengesellschaft
    Inventors: Artur Weitze, Peter Leskovar