Abstract: Disclosed herein are systems and methods of automated teller machine (ATM) management. The method can include receiving, from an ATM, an operating log from an out-of-band management chip. The method can further include determining, from the operating log, that the ATM is in an out-of-service state. The method can further include transmitting instructions to the out-of-band management chip to capture a system image of the ATM. In response, the method can include receiving the system image of the ATM from the out-of-band management chip and diagnosing a fault in the ATM based on the system image. The fault in the ATM can be the fault which caused the ATM to be in the out-of-service state. Finally, the method can include transmitting instructions for one or more corrective actions to the out-of-band management chip. The corrective actions can remedy the fault in the ATM.

Abstract: Disclosed herein are systems and methods of automated teller machine (ATM) management. The method can include receiving, from an ATM, an operating log from an out-of-band management chip. The method can further include determining, from the operating log, that the ATM is in an out-of-service state. The method can further include transmitting instructions to the out-of-band management chip to capture a system image of the ATM. In response, the method can include receiving the system image of the ATM from the out-of-band management chip and diagnosing a fault in the ATM based on the system image. The fault in the ATM can be the fault which caused the ATM to be in the out-of-service state. Finally, the method can include transmitting instructions for one or more corrective actions to the out-of-band management chip. The corrective actions can remedy the fault in the ATM.

Abstract: Disclosed herein are systems and methods of automated teller machine (ATM) management. The method can include receiving, from an ATM, an operating log from an out-of-band management chip. The method can further include determining, from the operating log, that the ATM is in an out-of-service state. The method can further include transmitting instructions to the out-of-band management chip to capture a system image of the ATM. In response, the method can include receiving the system image of the ATM from the out-of-band management chip and diagnosing a fault in the ATM based on the system image. The fault in the ATM can be the fault which caused the ATM to be in the out-of-service state. Finally, the method can include transmitting instructions for one or more corrective actions to the out-of-band management chip. The corrective actions can remedy the fault in the ATM.

Abstract: A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.

Abstract: A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.

Abstract: A method and apparatus for a backside metallization of a wafer is provided. The wafer comprised of a first substance is bent by creating tension on a backside and creating compression on a front side prior to deposition of a thin film of a second substance. After deposition, the wafer is released and the thin film deposited on the wafer exhibits less tensile stress than if the thin film was deposited on a flat wafer.