Patents by Inventor Arun Dhayalan

Arun Dhayalan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
    Publication number: 20230077895
    Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 16, 2023
    Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
  • Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
    Patent number: 11547030
    Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: January 3, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
  • Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
    Patent number: 11540432
    Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: December 27, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
  • ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
    Publication number: 20210100141
    Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
    Type: Application
    Filed: June 2, 2020
    Publication date: April 1, 2021
    Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
  • ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
    Publication number: 20210100087
    Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
    Type: Application
    Filed: June 2, 2020
    Publication date: April 1, 2021
    Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan