Abstract: A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.

Abstract: A large scale composite structure is fabricated by forming a plurality of composite laminate modules and joining the modules together along their edges using scarf joints.

Abstract: Systems and methods for assembling a skin of a composite structure are disclosed herein. The methods include operatively attaching a charge of composite material to a flexible substrate to define an initial conformation for a composite-substrate assembly and locating the composite-substrate assembly and a layup mandrel proximal to one another. The methods further include pressing the composite-substrate assembly against an outer surface of the layup mandrel to deform the composite-substrate assembly to a final conformation. The methods also include affixing the charge of composite material to the outer surface of the layup mandrel and releasing the charge of composite material from the flexible substrate while retaining the charge of composite material on the outer surface of the layup mandrel. The systems include the flexible substrate, the layup mandrel, and an assembly deformation structure that is configured to press the composite-substrate assembly against the outer surface of the layup mandrel.

Abstract: Methods and tools for forming composite structures with predetermined, non-planar patterns of contours, as well as apparatuses including such composite structures, are disclosed herein. Example methods include defining a pattern of contours in a flexible sheet of composite material, conforming the flexible sheet of composite material to a layup mandrel, and curing the flexible sheet of composite material. Example tools include a body with an engagement surface for engaging a flexible sheet of composite material, the body having regions of relative stiffness and regions of relative compliance, and a vacuum distribution manifold configured to selectively apply a vacuum to the regions of relative compliance to deform the engagement surface to define a predetermined, non-planar pattern of contours.

Abstract: A large scale composite structure is fabricated by forming a plurality of composite laminate modules and joining the modules together along their edges using scarf joints.

Abstract: Systems and methods for assembling a skin of a composite structure on an outer surface of an inner mold line layup mandrel. The systems and methods include receiving a plurality of ply kits, assembling the plurality of ply kits to form a skin segment that defines a portion of the skin, and affixing the skin segment to the outer surface of the layup mandrel. The assembling includes transferring a respective ply kit of the plurality of ply kits to a non-planar transfer tool, compacting the respective ply kit on the non-planar transfer tool, and repeating the transferring and the compacting for each ply kit in the plurality of ply kits to form the skin segment.

Abstract: Systems and methods for assembling a skin of a composite structure are disclosed herein. The methods include operatively attaching a charge of composite material to a flexible substrate to define an initial conformation for a composite-substrate assembly, deforming the composite-substrate assembly to an intermediate conformation that is different from the initial conformation, affixing the charge of composite material to an outer surface of a layup mandrel, and releasing the charge of composite material from the flexible substrate while retaining the charge of composite material on the outer surface of the layup mandrel. The systems include the flexible substrate, an assembly deformation structure that is configured to deform the composite-substrate assembly from the initial conformation to the intermediate conformation, and the layup mandrel that receives the charge of composite material.

Abstract: A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.

Abstract: Systems and methods for assembling a skin of a composite structure on an outer surface of an inner mold line layup mandrel. The systems and methods include receiving a plurality of ply kits, assembling the plurality of ply kits to form a skin segment that defines a portion of the skin, and affixing the skin segment to the outer surface of the layup mandrel. The assembling includes transferring a respective ply kit of the plurality of ply kits to a non-planar transfer tool, compacting the respective ply kit on the non-planar transfer tool, and repeating the transferring and the compacting for each ply kit in the plurality of ply kits to form the skin segment.

Abstract: A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.

Abstract: A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup.

Abstract: A large scale composite structure is fabricated by forming a plurality of composite laminate modules and joining the modules together along their edges using scarf joints.

Abstract: A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.

Abstract: To fabricate a composite item from a layup of composite material, the layup is degassed, debulked, and cured. To degas the layup, an envelope pressure within an envelope that includes the layup is reduced, a chamber pressure within a chamber that includes the envelope is reduced, and the layup is heated. To debulk the layup, the chamber pressure is increased relative to the envelope pressure so that the envelope exerts a compressive force upon the layup in response to the relatively higher chamber pressure as compared to the envelope pressure. To cure the layup, the layup is exposed to radiation.

Abstract: A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup.

Abstract: A large scale composite structure is fabricated by forming a plurality of composite laminate modules and joining the modules together along their edges using scarf joints.

Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.