Patents by Inventor Arvin Guo

Arvin Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit testing apparatus and method
    Patent number: 11639956
    Abstract: A test socket comprising a guide plate with a lower surface engaged with an upper surface of a main test structure, the guide plate further including an upper surface which is parallel to the lower surface and an opening extending through the guide plate, the main test structure includes a body with one or more apertures through the upper surface and one or more probes mounted within the main test structure, the probes including a front end which extends through the apertures for engagement by a lead or terminal pad of a device to be tested, and a tail end which is secured within the main test structure by an elastomeric material.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 2, 2023
    Assignee: UI Green Micro & Nano Technologies Co Ltd
    Inventors: Mark Zhang, Arvin Guo, Jeff Tamasi, Steve Liu
  • INTEGRATED CIRCUIT TESTING APPARATUS AND METHOD
    Publication number: 20210396802
    Abstract: A test socket comprising a guide plate with a lower surface engaged with an upper surface of a main test structure, the guide plate further including an upper surface which is parallel to the lower surface and an opening extending through the guide plate, the main test structure includes a body with one or more apertures through the upper surface and one or more probes mounted within the main test structure, the probes including a front end which extends through the apertures for engagement by a lead or terminal pad of a device to be tested, and a tail end which is secured within the main test structure by an elastomeric material.
    Type: Application
    Filed: September 7, 2021
    Publication date: December 23, 2021
    Inventors: Mark Zhang, Arvin Guo, Jeff Tamasi, Steve Liu
  • Integrated circuit testing apparatus and method
    Patent number: 11143699
    Abstract: A test socket comprising a guide plate with a lower surface engaged with an upper surface of a main test structure, the guide plate further including an upper surface which is parallel to the lower surface and an opening extending through the guide plate, the main test structure includes a body with one or more apertures through the upper surface and one or more probes mounted within the main test structure, the probes including a front end which extends through the apertures for engagement by a lead or terminal pad of a device to be tested, and a tail end which is secured within the main test structure by an elastomeric material.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 12, 2021
    Assignee: UI Green Micro & Nano Technologies Co Ltd
    Inventors: Mark Zhang, Arvin Guo, Jeff Tamasi, Steve Liu
  • INTEGRATED CIRCUIT TESTING APPARATUS AND METHOD
    Publication number: 20210255236
    Abstract: A test socket comprising a guide plate with a lower surface engaged with an upper surface of a main test structure, the guide plate further including an upper surface which is parallel to the lower surface and an opening extending through the guide plate, the main test structure includes a body with one or more apertures through the upper surface and one or more probes mounted within the main test structure, the probes including a front end which extends through the apertures for engagement by a lead or terminal pad of a device to be tested, and a tail end which is secured within the main test structure by an elastomeric material.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 19, 2021
    Inventors: Mark Zhang, Arvin Guo, Jeff Tamasi, Steve Liu