Patents by Inventor Arvind Sinha
Arvind Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240160360Abstract: Methods and systems for managing, storing, and serving data within a virtualized environment are described. In some embodiments, a data management system may manage the extraction and storage of virtual machine snapshots, provide near instantaneous restoration of a virtual machine or one or more files located on the virtual machine, and enable secondary workloads to directly use the data management system as a primary storage target to read or modify past versions of data. The data management system may allow a virtual machine snapshot of a virtual machine stored within the system to be directly mounted to enable substantially instantaneous virtual machine recovery of the virtual machine.Type: ApplicationFiled: January 24, 2024Publication date: May 16, 2024Inventors: Arvind Jain, Arvind Nithrakashyap, Bipul Sinha, Soham Mazumdar, Adam Gee, Kenny To, Jonathan Derryberry
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Patent number: 11947809Abstract: Methods and systems for managing, storing, and serving data within a virtualized environment are described. In some embodiments, a data management system may manage the extraction and storage of virtual machine snapshots, provide near instantaneous restoration of a virtual machine or one or more files located on the virtual machine, and enable secondary workloads to directly use the data management system as a primary storage target to read or modify past versions of data. The data management system may allow a virtual machine snapshot of a virtual machine stored within the system to be directly mounted to enable substantially instantaneous virtual machine recovery of the virtual machine.Type: GrantFiled: April 14, 2022Date of Patent: April 2, 2024Assignee: Rubrik, Inc.Inventors: Arvind Jain, Arvind Nithrakashyap, Bipul Sinha, Soham Mazumdar, Adam Gee, Kenny To, Jonathan Derryberry
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Publication number: 20080090440Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.Type: ApplicationFiled: October 1, 2007Publication date: April 17, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Joseph Kuczynski, Theron Lewis, Amanda Mikhail, Arvind Sinha
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Publication number: 20080000087Abstract: A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.Type: ApplicationFiled: July 9, 2007Publication date: January 3, 2008Inventors: Joseph Kuczynski, Arvind Sinha
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Apparatus for Effecting Reliable Heat Transfer of Bare Die Microelectroinc Device and Method Thereof
Publication number: 20070241449Abstract: Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.Type: ApplicationFiled: June 22, 2007Publication date: October 18, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Colbert, Justin Rogers, Arvind Sinha -
Publication number: 20070155302Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.Type: ApplicationFiled: March 14, 2007Publication date: July 5, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Dangler, Phillip Isaacs, Arvind Sinha
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Publication number: 20070086168Abstract: A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.Type: ApplicationFiled: October 13, 2005Publication date: April 19, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar Khanna, Joseph Kuczynski, Arvind Sinha, Sri Sri-Jayantha
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Publication number: 20070035937Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.Type: ApplicationFiled: August 11, 2005Publication date: February 15, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Colbert, Eric Eckberg, Roger Hamilton, Mark Hoffmeyer, Amanda Mikhail, Arvind Sinha
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Patent number: 7087210Abstract: The present invention relates to a single-step simple and economical process for the preparation of nanosized acicular magnetic iron oxide particles of maghemite phase of size ranging between 300–350 nm in magnetic field at room temperature by biomimetic route, and a method of obtaining a magnetic memory storage device using the said particles.Type: GrantFiled: October 28, 2003Date of Patent: August 8, 2006Assignee: Council of Scientific & Industrial ResearchInventors: Arvind Sinha, Jui Chakraborty, Venkatesh Rao
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Publication number: 20060170904Abstract: Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.Type: ApplicationFiled: February 3, 2005Publication date: August 3, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joseph Kuczynski, Arvind Sinha, Kevin Splittstoesser, Timothy Tofil, Paul Vermilyea
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Publication number: 20060124705Abstract: A reflow heating system includes a housing assembly defining an internal thermal processing chamber that encapsulates at least a microelectronic assembly on a substrate. A first heating source is coupled to the housing assembly and within the thermal processing chamber. The first heating source is biased by a force-applying assembly into engagement with the microelectronic assembly. The first heating source comprises one or more heating platens adapted to engage the microelectronic assembly for applying direct heat sufficient to melt solder. A vacuum assembly is incorporated in the heating platen for allowing application of at least a partial vacuum to the microelectronic assembly to permit withdrawal thereof from the substrate. A radiant heating source is applied beneath the substrate and a directional heating source is applied to the microelectronic assembly.Type: ApplicationFiled: December 9, 2004Publication date: June 15, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joseph Kuczynski, Arvind Sinha, Timothy Tofil
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Publication number: 20060090918Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.Type: ApplicationFiled: November 4, 2004Publication date: May 4, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Dangler, Phillip Isaacs, Arvind Sinha
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Publication number: 20050275420Abstract: An apparatus adapted for use in a field replacement unit that is to be coupled to an electronic module. Included in the apparatus are a cover assembly; a biasing assembly disposed within the cover assembly; and, an aligning and coupling mechanism retained in the cover assembly in juxtaposed relation with the biasing assembly for mounting an interposer assembly in a manner, whereby the interposer assembly is generally self-aligned along in-plane axes with respect to the cover assembly for subsequent coupling to an electronic module. A method for use of the apparatus is disclosed.Type: ApplicationFiled: June 10, 2004Publication date: December 15, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Colbert, Roger Hamilton, Arvind Sinha
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Publication number: 20050207127Abstract: A tamper-proof enclosure for an electrical card, such as a high speed communications card, includes an enclosure in which the card is mounted. The enclosure has a wall with an opening, and a cup member is attached to the wall at the opening. A bus that is connected to the card extends through a passage in the cup member and through the opening in the wall. A security mesh is wrapped around the enclosure. The cup member is filled with liquid resin, which is also coated onto the security mesh. After the resin is cured, the resin in the cup member forms a plug that seals the security mesh from inner pressure when the enclosure is heated to an elevated temperature. The resin is preferably polyamide.Type: ApplicationFiled: March 18, 2004Publication date: September 22, 2005Applicant: International Business Machines CorporationInventor: Arvind Sinha
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Publication number: 20050122691Abstract: A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.Type: ApplicationFiled: December 4, 2003Publication date: June 9, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin Crippen, Pat Gallarelli, Benjamin Kreuz, Arvind Sinha
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Publication number: 20050006055Abstract: A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including at least one mounting member directly coupled to the base and for direct attachment to the electronic component so that loading forces for mounting on it the electronic component are not directly applied to the base. The thermally conductive member is a graphite-based material. A compliant force applying mechanism is mounted generally on the base for controlling forces applied on the base.Type: ApplicationFiled: June 26, 2003Publication date: January 13, 2005Inventors: John Colbert, Roger Hamilton, Arvind Sinha
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Patent number: 6800271Abstract: The present invention relates to a biomimetic process for preparation of nanosized magnetite particles used for the enhancement of magnetic resonance imaging contrast.Type: GrantFiled: April 1, 2002Date of Patent: October 5, 2004Assignee: Council of Scientific and Industrial ResearchInventors: Arvind Sinha, Jui Chakraborty, Samar Das, Swapan K. Das, Venkatesh Rao, Patcha R. Rao
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Publication number: 20040179997Abstract: The present invention relates to a single-step simple and economical process for the preparation of nanosized acicular magnetic iron oxide particles of maghemite phase of size ranging between 300-350 nm in magnetic field at room temperature by biomimetic route, and a method of obtaining a magnetic memory storage device using the said particles.Type: ApplicationFiled: October 28, 2003Publication date: September 16, 2004Applicant: COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCHInventors: Arvind Sinha, Jui Chakraborty, Venkatesh Rao
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Publication number: 20030217620Abstract: The present invention relates to an improved process for the production of neodymium-iron-boron permanent magnet alloy powder. The neodymium-iron-boron alloy prepared by the process of the present invention can be processed further to get anisotropic permanent magnets, bonded as well as sintered.Type: ApplicationFiled: March 20, 2003Publication date: November 27, 2003Applicant: COUNCIL SCIENTIFIC AND INDUSTRIAL RESEARCHInventors: Patcha Ramachandra Rao, Venkatesh Rao, Arvind Sinha
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Publication number: 20030185748Abstract: The present invention relates to a biomimetic process for preparation of nanosized magnetite particles used for the enhancement of magnetic resonance imaging contrast.Type: ApplicationFiled: April 1, 2002Publication date: October 2, 2003Inventors: Arvind Sinha, Jui Chakraborty, Samar Das, Swapan K. Das, Venkatesh Rao, Patcha R. Rao