Abstract: A waste bag dispensing system comprising a base member defining a cavity configured to receive a waste bag roll, a cap configured to removably secure to the base member, a slit opening extending through the base member, a separator, and a securement means to secure the system to an object, such as a leash. The roll may comprise a plurality of waste bags in perforated connection around a hollow spool configured to removably receive a base friction post and a cap friction post, the friction posts applying a lateral pressure on the waste bag roll and a tab may apply pressure on an exterior of the roll. An end of the roll may extend through the slit opening towards the separator which may engage the perforated connection and permit the removal of one waste bag from the roll. The securement means may comprise a lateral and vertical stability means.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: Disclosed is a secure enclosure such as a safe that may be used sequentially by multiply users that includes a programmed data processing unit and an input device for the user to input information to the data processing unit. The input device could be an SMS code, PIN or a biometric sensor such as, for example, a fingerprint scanner. The programmable software enables a user to input specific operating information for providing access to the enclosure, as well as enabling such user to input a code for another device such as a mobile device selected by this user. The mobile device could be any device that is external to the secure enclosure, and may include a mobile phone, tablet or other device conveying information to a user of the condition of the safe and its use.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.